Step and flash imprint lithography for semiconductor high volume manufacturing?

M. Malloy; L. C. Litt

doi:10.1117/12.846617

1 April 2010 Step and flash imprint lithography for semiconductor high volume manufacturing?

M. Malloy, L. C. Litt

Proceedings Volume 7637, Alternative Lithographic Technologies II; 763706 (2010) https://doi.org/10.1117/12.846617
Event: SPIE Advanced Lithography, 2010, San Jose, California, United States

Abstract

Step and Flash Imprint Lithography (SFIL), a form of ultraviolet nanoimprint lithography (UV-NIL), is recognized for its resolution and patterning abilities. It is one of the few next generation lithography techniques capable of meeting the resolution requirements of future semiconductor devices. However, many integration issues such as defectivity, throughput, and overlay must be resolved before SFIL can be used for semiconductor high volume manufacturing (HVM). This paper discusses the current status of SFIL, including the process and templates, and shows where more industry collaboration is needed to solve the most critical issues.

Citation Download Citation

M. Malloy and L. C. Litt "Step and flash imprint lithography for semiconductor high volume manufacturing?", Proc. SPIE 7637, Alternative Lithographic Technologies II, 763706 (1 April 2010); https://doi.org/10.1117/12.846617

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