Study on residual stresses in ultrasonic torsional vibration assisted micro-milling

Zesheng Lu; Haijun Hu; Yazhou Sun; Qing Sun

doi:10.1117/12.866104

22 October 2010 Study on residual stresses in ultrasonic torsional vibration assisted micro-milling

Zesheng Lu, Haijun Hu, Yazhou Sun, Qing Sun

Proceedings Volume 7657, 5th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Design, Manufacturing, and Testing of Micro- and Nano-Optical Devices and Systems; 76571F (2010) https://doi.org/10.1117/12.866104
Event: 5th International Symposium on Advanced Optical Manufacturing and Testing Technologies, 2010, Dalian, China

Abstract

It is well known that machining induced residual stresses can seriously affect the dimensional accuracy, corrosion and wear resistance, etc., and further influence the longevity and reliability of Micro-Optical Components (MOC). In Ultrasonic Torsional Vibration Assisted Micro-milling (UTVAM), cutting parameters, vibration parameters, mill cutter parameters, the status of wear length of tool flank are the main factors which affect residual stresses. A 2D model of UTVAM was established with FE analysis software ABAQUS. Johnson-Cook's flow stress model and shear failure principle are used as the workpiece material model and failure principle, while friction between tool and workpiece uses modified Coulomb's law whose sliding friction area is combined with sticking friction. By means of FEA, the influence rules of cutting parameters, vibration parameters, mill cutter parameters, the status of wear length of tool flank on residual stresses are obtained, which provides a basis for choosing optimal process parameters and improving the longevity and reliability of MOC.

Citation Download Citation

Zesheng Lu, Haijun Hu, Yazhou Sun, and Qing Sun "Study on residual stresses in ultrasonic torsional vibration assisted micro-milling", Proc. SPIE 7657, 5th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Design, Manufacturing, and Testing of Micro- and Nano-Optical Devices and Systems, 76571F (22 October 2010); https://doi.org/10.1117/12.866104

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