Comparisons of the new thick negative resist to Su8 resist

D. Bourrier; M. Dilhan; A. Ghannam; H. Granier

doi:10.1117/12.870496

15 April 2011 Comparisons of the new thick negative resist to Su8 resist

D. Bourrier, M. Dilhan, A. Ghannam, H. Granier

Proceedings Volume 7972, Advances in Resist Materials and Processing Technology XXVIII; 79722F (2011) https://doi.org/10.1117/12.870496
Event: SPIE Advanced Lithography, 2011, San Jose, California, United States

Abstract

This work deals with recent advances in the microfabrication process technology for medium to high-aspect ratio structures fabricated by UV photolithography using different kinds of photoresists. The resulting structures were used as molds and will be transformed into metal structures by electroplating. Two types of photoresists are compared: epoxy-based (negative) SU-8 and acrylate-based (negative) Intervia BPN. This work was prompted by the need to find an alternative to SU-8 photoresist which is difficult to process and remove after electroplating. The results presented in this paper open up new possibilities for low-cost processes using electroplating in MEMS applications.

Citation Download Citation

D. Bourrier, M. Dilhan, A. Ghannam, and H. Granier "Comparisons of the new thick negative resist to Su8 resist", Proc. SPIE 7972, Advances in Resist Materials and Processing Technology XXVIII, 79722F (15 April 2011); https://doi.org/10.1117/12.870496

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