Paper
4 April 2011 Defect-aware reticle floorplanning for EUV masks
Author Affiliations +
Abstract
Fabricating defect-free mask blanks remains a major "show-stopper" for adoption of EUV lithography. One promising approach to alleviate this problem is reticle floorplanning with the goal of minimizing the design impact of buried defects. In this work, we propose a simulated annealing based gridded floorplanner for single project reticles that minimizes the design impact of buried defects. Our results show a substantial improvement in mask yield with this approach. For a 40-defect mask, our approach can improve mask yield from 53% to 94%. If additional design information is available, it can be exploited for more accurate yield computation and further improvement in mask yield, up to 99% for a 40-defect mask. These improvements are achieved with a limited area overhead of 0.03% on the exposure field. Defect-aware floorplanning also reduces sensitivity of mask yield to defect dimensions.
© (2011) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Abde Ali Kagalwalla, Puneet Gupta, Duck-Hyung Hur, and Chul-Hong Park "Defect-aware reticle floorplanning for EUV masks", Proc. SPIE 7974, Design for Manufacturability through Design-Process Integration V, 79740Z (4 April 2011); https://doi.org/10.1117/12.881667
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Cited by 9 scholarly publications.
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KEYWORDS
Photomasks

Reticles

Yield improvement

Extreme ultraviolet

Tolerancing

Critical dimension metrology

Algorithms

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