Dissipative particle dynamics simulations to optimize contact hole shrink process using graphoepitaxial directed self-assembly

Hironobu Sato; Hiroki Yonemitsu; Yuriko Seino; Hirokazu Kato; Masahiro Kanno; Katsutoshi Kobayashi; Ayako Kawanishi; Katsuyoshi Kodera; Tsukasa Azuma

doi:10.1117/12.2009622

26 March 2013 Dissipative particle dynamics simulations to optimize contact hole shrink process using graphoepitaxial directed self-assembly

Hironobu Sato, Hiroki Yonemitsu, Yuriko Seino, Hirokazu Kato, Masahiro Kanno, Katsutoshi Kobayashi, Ayako Kawanishi, Katsuyoshi Kodera, Tsukasa Azuma

Author Affiliations +

Proceedings Volume 8680, Alternative Lithographic Technologies V; 86801K (2013) https://doi.org/10.1117/12.2009622
Event: SPIE Advanced Lithography, 2013, San Jose, California, United States

Abstract

Dissipative particle dynamics (DPD) simulations are utilized to optimize contact hole shrink process using graphoepitaxial directed self-assembly (DSA). In this work, poly (styrene-block-methyl methacrylate) (PS-b-PMMA) was employed. In the contact hole shrink process, PS residual layer was formed on the bottom floor of the hole type prepattern. To realize reliable contact hole shrink process, minimization of the thickness of PS residual layer was one of the key issues. It was found that the minimization of the thickness of the PS residual layer and optimization of threedimensional configuration of the PMMA domain was trade-off relationship. By using DPD simulations, the parameters were successfully optimized to achieve residual layer free contact hole shrink of DSA lithography.

Citation Download Citation

Hironobu Sato, Hiroki Yonemitsu, Yuriko Seino, Hirokazu Kato, Masahiro Kanno, Katsutoshi Kobayashi, Ayako Kawanishi, Katsuyoshi Kodera, and Tsukasa Azuma "Dissipative particle dynamics simulations to optimize contact hole shrink process using graphoepitaxial directed self-assembly", Proc. SPIE 8680, Alternative Lithographic Technologies V, 86801K (26 March 2013); https://doi.org/10.1117/12.2009622

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