Fabrication of double-sided micro structured mechanical sensors based on SU-8 resist using a new micro molding process

A. Oerke; S. Büttgenbach; A. Dietzel

doi:10.1117/12.2017294

17 May 2013 Fabrication of double-sided micro structured mechanical sensors based on SU-8 resist using a new micro molding process

A. Oerke, S. Büttgenbach, A. Dietzel

Author Affiliations +

Proceedings Volume 8763, Smart Sensors, Actuators, and MEMS VI; 876331 (2013) https://doi.org/10.1117/12.2017294
Event: SPIE Microtechnologies, 2013, Grenoble, France

Abstract

Advances in micro and nano fabrication technologies for MEMS require high-level measurement techniques with regard to sampling and sensitivity. For this purpose at the Institute of Microtechnology (IMT) highly sensitive piezoresistive 3D force sensors based on SU-8 polymer have been developed. In this paper we present an improved micro fabrication process for a double-sided micro structured design. The sensors are produced by multilayer processing techniques such as UV lithography and coating methods. The double-sided micro structured design demands a photoresist application method which simultaneously features a top side structuring and a casting from a mold. We use a new micro molding process to meet the demands. The micro fabrication technology is described, focusing on the development of the molding structure for shaping of the bottom side and a capable release process for the detachment of the molded structures. The fabrication process of the SU-8 mold layer is optimized to fabricate molding structures with heights from a few μm up to 350 μm. Therefore different SU-8 formulations, namely with classification numbers 5, 25, 50, and 100, have been used. The fundamental limitations for the mold design result from the lithography process, which defines the smallest lateral resolution, and from the characteristics of a molding process, e. g. the impossibility to realize an undercut. To allow for reliable release, the molding structures have to be coated with a sacrificial layer. A silicon nitride is deposited onto the substrate with an accompanying monitoring of the deposition temperature during the PECVD process.

Citation Download Citation

A. Oerke, S. Büttgenbach, and A. Dietzel "Fabrication of double-sided micro structured mechanical sensors based on SU-8 resist using a new micro molding process", Proc. SPIE 8763, Smart Sensors, Actuators, and MEMS VI, 876331 (17 May 2013); https://doi.org/10.1117/12.2017294

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available

Members: $17.00

Non-members: $21.00 ADD TO CART

PROCEEDINGS
6 PAGES

DOWNLOAD PAPER SAVE TO MY LIBRARY

GET CITATION

RIGHTS & PERMISSIONS

Get copyright permission Get copyright permission on Copyright Marketplace

KEYWORDS

Photoresist processing

Plasma

Lithography

Sensors

Microelectromechanical systems

Silicon

Ultraviolet radiation

Show All Keywords

Keywords/Phrases

Search In:

Publication Years