SCM Simulation Of Secondary Electron Signals Detected By MCP

Ryoh Mimura; Atsushi Yamada; Ryuso Aihara; Mike Hassel Shearer; William Thompson

doi:10.1117/12.968351

1 January 1988 SCM Simulation Of Secondary Electron Signals Detected By MCP

Ryoh Mimura, Atsushi Yamada, Ryuso Aihara, Mike Hassel Shearer, William Thompson

Proceedings Volume 0921, Integrated Circuit Metrology, Inspection, and Process Control II; (1988) https://doi.org/10.1117/12.968351
Event: Santa Clara Symposium on Microlithography, 1988, Santa Clara, CA, United States

Abstract

An annular shape micro channel plate(MCP) placed above a wafer is a detector suited for electron beam (EB) line-width measurement. Acceptance diagrams for secondary electrons and packscattered electrons on the MCP detector were obtained by the surface charge method (SCM) calculation. The secondary electron detection efficiencies on the MCP detector were also obtained from this calculation. By applying adequate bias voltage at the center pipe of the MCP detector, the efficiency is increased to 95%.

Citation Download Citation

Ryoh Mimura, Atsushi Yamada, Ryuso Aihara, Mike Hassel Shearer, and William Thompson "SCM Simulation Of Secondary Electron Signals Detected By MCP", Proc. SPIE 0921, Integrated Circuit Metrology, Inspection, and Process Control II, (1 January 1988); https://doi.org/10.1117/12.968351

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