Paper
22 March 2016 Virtual fabrication using directed self-assembly for process optimization in a 14nm DRAM
Mattan Kamon, Mustafa Akbulut, Yiguang Yan, Daniel Faken, Andras Pap, Vasanth Allampalli, Ken Greiner, David Fried
Author Affiliations +
Abstract
For Directed Self-Assembly (DSA) to be deployed in advanced semiconductor technologies, it must reliably integrate into a full process flow. We present a methodology for using virtual fabrication software, including predictive DSA process models, to develop and analyze the replacement of SAQP patterning with LiNe chemoepitaxy on a 14nm DRAM process. To quantify the impact of this module replacement, we investigate a key process yield metric for DRAM: interface area between the capacitor contacts and transistor source/drain. Additionally, we demonstrate virtual fabrication of the DRAM cell’s hexagonally-packed capacitors patterned with an array of diblock copolymer cylinders in place of LE4 patterning.
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Mattan Kamon, Mustafa Akbulut, Yiguang Yan, Daniel Faken, Andras Pap, Vasanth Allampalli, Ken Greiner, and David Fried "Virtual fabrication using directed self-assembly for process optimization in a 14nm DRAM", Proc. SPIE 9777, Alternative Lithographic Technologies VIII, 977710 (22 March 2016); https://doi.org/10.1117/12.2218935
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Cited by 2 scholarly publications.
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KEYWORDS
Optical lithography

Etching

Directed self assembly

Capacitors

Process modeling

Reactive ion etching

Device simulation

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