Topical areas covered include:

Lithography: tools, materials, and processes associated with the patterning of structures that have submicrometer and nanometer-scale features. Included are imaging and nonimaging approaches using optics, electron and other particle beams, nanoimprint, molecular self-assembly, and their hybrids. Applications include semiconductor fabrication, but also patterning for other micro/nanodevices.

Microelectromechanical systems (MEMS): the design, fabrication, operation, reliability, and testing of microdevices that contain both electrical and mechanical elements.

Micro-optoelectromechanical systems (MOEMS): the design, fabrication, operation, reliability, and testing of microdevices that contain electrical, mechanical, and optical elements (that is, the merging of micro-optics and MEMS).

Microfabrication: technologies to shape three-dimensional structures leading to the fabrication of active and passive electronics, photonics, MEMS, MOEMS, micro/nano-optics, and other micro/nanodevices.

Metrology: metrology and process control for the above devices and their fabrication processes.

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