Dr. Florian Letzkus Profile

Dr. Florian Letzkus

at Institut für Mikroelektronik Stuttgart

SPIE Involvement:

Author

Publications (39)

Proceedings Article | 20 August 2020 Presentation

Comparison of the high-frequency performance of staggered and coplanar organic thin-film transistors using two-port network analysis

James Borchert, Ute Zschieschang, Florian Letzkus, Michele Giorgio, R. Thomas Weitz, Mario Caironi, Joachim Burghartz, Sabine Ludwigs, Hagen Klauk

Proceedings Volume 11476, 114760U (2020) https://doi.org/10.1117/12.2567978

KEYWORDS: Thin films, Transistors, Network security, Resistance, Silicon, Photomasks, Lithography

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Proceedings Article | 2 June 2017 Paper

Alkaline fuel cell with nitride membrane

Shen-Huei Sun, Moritz Pilaski, Jens Wartmann, Florian Letzkus, Benedikt Funke, Georg Dura, Angelika Heinzel

Proceedings Volume 10246, 102460T (2017) https://doi.org/10.1117/12.2265689

KEYWORDS: Low pressure chemical vapor deposition, Coating, Plasma enhanced chemical vapor deposition, Radiation thermography, Refractive index, Deposition processes, Printing, Chemical vapor deposition, Ion implantation, Platinum, Polymers, Manufacturing, Metals, Silicon, Semiconducting wafers, Electrodes, Silver, Visible radiation

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Proceedings Article | 13 May 2016 Presentation + Paper

Echelle grating for silicon photonics applications: integration of electron beam lithography in the process flow and first results

Mathias Kaschel, Florian Letzkus, Jörg Butschke, Piotr Skwierawski, Marc Schneider, Marc Weber

Proceedings Volume 9891, 98911V (2016) https://doi.org/10.1117/12.2228817

KEYWORDS: Modulators, Waveguides, Multiplexers, Optical design

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Proceedings Article | 5 October 2015 Presentation

Flexible low-voltage organic integrated circuits with megahertz switching frequencies (Presentation Recording)

Ute Zschieschang, Kazuo Takimiya, Tarek Zaki, Florian Letzkus, Harald Richter, Joachim Burghartz, Hagen Klauk

Proceedings Volume 9569, 95690E (2015) https://doi.org/10.1117/12.2187847

KEYWORDS: Integrated circuits, Organic semiconductors, Switching, Transistors, Oscillators, Thin films, Electrodes, Silicon, Photomasks, Optical lithography

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Proceedings Article | 14 October 2011 Paper

Si stencil masks for organic thin film transistor fabrication

Florian Letzkus, Tarek Zaki, Frederik Ante, Harald Richter, Joachim Burghartz, Jörg Butschke, Hagen Klauck

Proceedings Volume 8166, 81662B (2011) https://doi.org/10.1117/12.899168

KEYWORDS: Photomasks, Silicon, Etching, Gold, Metals, Electron beam lithography, Semiconducting wafers, Scanning electron microscopy, Aluminum, Transistors

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Proceedings Article | 23 September 2009 Paper

3D Si aperture-plates combined with programmable blanking-plates for multi-beam mask writing

Florian Letzkus, Mathias Irmscher, Michael Jurisch, Elmar Platzgummer, Christof Klein, Hans Loeschner

Proceedings Volume 7488, 74883C (2009) https://doi.org/10.1117/12.829630

KEYWORDS: Silicon, Etching, Electrodes, Semiconducting wafers, Photomasks, Lithography, 3D metrology, Standards development, Beam shaping, Oxides

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Proceedings Article | 23 September 2009 Paper

Charged particle multi-beam lithography evaluations for sub-16nm hp mask node fabrication and wafer direct write

Elmar Platzgummer, Christof Klein, Peter Joechl, Hans Loeschner, Martin Witt, Wolfgang Pilz, Joerg Butschke, Michael Jurisch, Florian Letzkus, Holger Sailer, Mathias Irmscher

Proceedings Volume 7488, 74881D (2009) https://doi.org/10.1117/12.832156

KEYWORDS: Photomasks, Ions, Semiconducting wafers, Lithography, Nanofabrication, Silicon, Particles, Electronics, Nanostructures, Electron beams

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Proceedings Article | 18 March 2009 Paper

PML2: the maskless multibeam solution for the 22nm node and beyond

C. Klein, E. Platzgummer, J. Klikovits, W. Piller, H. Loeschner, T. Bejdak, P. Dolezel, V. Kolarik, W. Klingler, F. Letzkus, J. Butschke, M. Irmscher, M. Witt, W. Pilz, P. Jaschinsky, F. Thrum, C. Hohle, J. Kretz, J. Nogatch, A. Zepka

Proceedings Volume 7271, 72710N (2009) https://doi.org/10.1117/12.813670

KEYWORDS: Semiconducting wafers, Lithography, Electron beams, Electrodes, Prototyping, Electron beam lithography, Electron beam direct write lithography, Silicon, Optical alignment, Photomasks

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Proceedings Article | 20 October 2008 Paper

Deflection unit for multi-beam mask making

Florian Letzkus, Joerg Butschke, Mathias Irmscher, Michael Jurisch, Wolfram Klingler, Elmar Platzgummer, Christof Klein, Hans Loeschner, Reinhard Springer

Proceedings Volume 7122, 712235 (2008) https://doi.org/10.1117/12.801401

KEYWORDS: Etching, Silicon, Electrodes, Semiconducting wafers, Lithography, Aluminum, Mask making, Optical alignment, Switching, Line edge roughness

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Two main challenges of future mask making are the decreasing throughput of the pattern generators and the insufficient line edge roughness of the resist structures. The increasing design complexity with smaller feature sizes combined with additional pattern elements of the Optical Proximity Correction generates huge data volumes which reduce correspondingly the throughput of conventional single e-beam pattern generators. On the other hand the achievable line edge roughness when using sensitive chemically amplified resists does not fulfill the future requirements. The application of less sensitive resists may provide an improved roughness, however on account of throughput, as well. To overcome this challenge a proton multi-beam pattern generator is developed [1]. Starting with a highly parallel broad beam, an aperture-plate is used to generate thousands of separate spot beams. These beams pass through a blanking-plate unit, based on a CMOS device for de-multiplexing the writing data and equipped with electrodes placed around the apertures switching the beams "on" or "off", dependent on the desired pattern. The beam array is demagnified by a 200x reduction optics and the exposure of the entire substrate is done by a continuous moving stage. One major challenge is the fabrication of the required high aspect deflection electrodes and their connection to the CMOS device. One approach is to combine a post-processed CMOS chip with a MEMS component containing the deflection electrodes and to realize the electrical connection of both by vertical integration techniques. For the evaluation and assessment of this considered scheme and fabrication technique, a proof-of-concept deflection unit has been realized and tested. Our design is based on the generation of the deflection electrodes in a silicon membrane by etching trenches and oxide filling afterwards. In a 5mm x 5mm area 43,000 apertures with the corresponding electrodes have been structured and wired individually or in groups with aluminum lines. The aperture-plate for shaping the beams has been aligned and mounted on top of the blanking-plate. Afterwards this sandwich has been fixed on a base-plate with a pin plug as interface. The electrical connection has been performed with a standard chip bonding process to the aluminum pads on the blanking-plate. Finally, the proof-of-concept deflection unit was evaluated in a test bench. The results of electrical- and exposure tests are presented and discussed in detail.

Proceedings Article | 28 March 2008 Paper

MAGIC: a European program to push the insertion of maskless lithography

L. Pain, B. Icard, S. Tedesco, B. Kampherbeek, G. Gross, C. Klein, H. Loeschner, E. Platzgummer, R. Morgan, S. Manakli, J. Kretz, C. Holhe, K.-H. Choi, F. Thrum, E. Kassel, W. Pilz, K. Keil, J. Butschke, M. Irmscher, F. Letzkus, P. Hudek, A. Paraskevopoulos, P. Ramm, J. Weber

Proceedings Volume 6921, 69211S (2008) https://doi.org/10.1117/12.772472

KEYWORDS: Semiconducting wafers, Lithography, Photomasks, Manufacturing, Electron beams, Electron beam lithography, Nanofabrication, Computed tomography, Prototyping, Maskless lithography

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Proceedings Article | 20 March 2008 Paper

Projection maskless lithography (PML2): proof-of-concept setup and first experimental results

C. Klein, E. Platzgummer, H. Loeschner, G. Gross, P. Dolezel, M. Tmej, V. Kolarik, W. Klingler, F. Letzkus, J. Butschke, M. Irmscher, M. Witt, W. Pilz

Proceedings Volume 6921, 69211O (2008) https://doi.org/10.1117/12.772726

KEYWORDS: Semiconducting wafers, Lithography, Electron beams, Silicon, Electrodes, Polymethylmethacrylate, Maskless lithography, Electron beam lithography, Wafer-level optics, Nanofabrication

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Proceedings Article | 1 November 2007 Paper

Resistless mask structuring using an ion multi-beam projection pattern generator

Joerg Butschke, Mathias Irmscher, Florian Letzkus, Hans Loeschner, Lorenz Nedelmann, Elmar Platzgummer

Proceedings Volume 6730, 673047 (2007) https://doi.org/10.1117/12.742797

KEYWORDS: Photomasks, Etching, Ions, Photoresist processing, Optical lithography, Electron beam lithography, Ion beams, Line edge roughness, Chemically amplified resists, Nanofabrication

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Proceedings Article | 15 May 2007 Paper

Dry etch behavior of different TaN absorber layers for EUVL mask making

Florian Letzkus, Günter Hess, Mathias Irmscher, Konrad Knapp, Markus Renno, Eugen Röhrle, Holger Seitz

Proceedings Volume 6607, 66073D (2007) https://doi.org/10.1117/12.729032

KEYWORDS: Etching, Dry etching, Extreme ultraviolet lithography, Reflectivity, Photomasks, Inspection, Scanning electron microscopy, Mask making, Electron beam lithography, Manufacturing

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Proceedings Article | 20 October 2006 Paper

Manufacturing of the first EUV full-field scanner mask

Uwe Dersch, Rico Buettner, Christian Chovino, Steffen Franz, Torben Heins, Holger Herguth, Jan Hendrik Peters, Thomas Rode, Florian Letzkus, Joerg Butschke, Mathias Irmscher

Proceedings Volume 6349, 63492G (2006) https://doi.org/10.1117/12.686035

KEYWORDS: Etching, Extreme ultraviolet, Photomasks, Reflectivity, Manufacturing, Extreme ultraviolet lithography, Scanners, Optical lithography, Photoresist processing, Chromium

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Proceedings Article | 23 March 2006 Paper

NIL template manufacturing using a variable shaped e-beam writer and a new pCAR

Mathias Irmscher, Joerg Butschke, Guenter Hess, Corinna Koepernik, Florian Letzkus, Markus Renno, Holger Sailer, Hubert Schulz, Anatol Schwersenz, Ecron Thompson

Proceedings Volume 6151, 615115 (2006) https://doi.org/10.1117/12.656108

KEYWORDS: Etching, Quartz, Nanoimprint lithography, Photoresist processing, Photomasks, Chromium, Manufacturing, Electron beam lithography, Chemically amplified resists, Beam shaping

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Proceedings Article | 22 March 2006 Paper

EUVL mask blanks: Recent results on substrates, multilayers and the dry-etch process of TaN-absorbers

Holger Seitz, Markus Renno, Thomas Leutbecher, Nathalie Olschewski, Torsten Reichardt, Ronny Walter, Helmut Popp, Günter Hess, Florian Letzkus, Jörg Butschke, Mathias Irmscher

Proceedings Volume 6151, 615109 (2006) https://doi.org/10.1117/12.655540

KEYWORDS: Photomasks, Extreme ultraviolet lithography, Etching, Extreme ultraviolet, Multilayers, Dry etching, Polishing, Manufacturing, Reflectivity, Coating

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Proceedings Article | 22 March 2006 Paper

Demonstration of phase-shift masks for extreme-ultraviolet lithography

Bruno La Fontaine, Adam Pawloski, Obert Wood, Yunfei Deng, Harry Levinson, Patrick Naulleau, Paul Denham, Eric Gullikson, Brian Hoef, Christian Holfeld, Christian Chovino, Florian Letzkus

Proceedings Volume 6151, 61510A (2006) https://doi.org/10.1117/12.652212

KEYWORDS: Photomasks, Extreme ultraviolet, Reflectivity, Etching, Extreme ultraviolet lithography, Printing, Multilayers, Metrology, Scanning electron microscopy, Lithography

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Proceedings Article | 8 November 2005 Paper

EUVL mask manufacturing: technologies and results

Florian Letzkus, Joerg Butschke, Mathias Irmscher, Holger Sailer, Uwe Dersch, Christian Holfeld

Proceedings Volume 5992, 59922A (2005) https://doi.org/10.1117/12.628957

KEYWORDS: Etching, Extreme ultraviolet lithography, Wet etching, Photomasks, Dry etching, Chromium, Electron beam lithography, Scanning electron microscopy, Silicon, Manufacturing

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Proceedings Article | 8 November 2005 Paper

Template manufacturing for nanoimprint lithography using existing infrastructure

Mathias Irmscher, Joerg Butschke, Guenter Hess, Florian Letzkus, Markus Renno, Holger Sailer, Hubert Schulz, Anatol Schwersenz, Ecron Thompson, Boris Vratzov

Proceedings Volume 5992, 59922E (2005) https://doi.org/10.1117/12.629974

KEYWORDS: Etching, Quartz, Manufacturing, Nanoimprint lithography, Photomasks, Photoresist processing, Electron beam lithography, Chromium, Chemically amplified resists, Printing

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Proceedings Article | 10 May 2005 Paper

Impact of EUV mask pattern profile shape on CD measured by CD-SEM

Uwe Dersch, Arnd Korn, Cornelia Engelmann, Carl Frase, Wolfgang Haessler-Grohne, Harald Bosse, Florian Letzkus, Joerg Butschke

Proceedings Volume 5752, (2005) https://doi.org/10.1117/12.598644

KEYWORDS: Critical dimension metrology, Scanning electron microscopy, Monte Carlo methods, Extreme ultraviolet, Photomasks, Detection and tracking algorithms, Silicon, Electron beams, Extreme ultraviolet lithography, Signal detection

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Proceedings Article | 6 May 2005 Paper

Comparison of EUV mask architectures by process window analysis

Siegfried Schwarzl, Frank-Michael Kamm, Stefan Hirscher, Klaus Lowack, Wolf-Dieter Domke, Markus Bender, Stefan Wurm, Adam Pawloski, Bruno La Fontaine, Christian Holfeld, Uwe Dersch, Florian Letzkus, Joerg Butschke

Proceedings Volume 5751, (2005) https://doi.org/10.1117/12.599343

KEYWORDS: Photomasks, Extreme ultraviolet, Semiconducting wafers, Multilayers, Printing, Scanning electron microscopy, Cadmium, Extreme ultraviolet lithography, Binary data, Imaging systems

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Proceedings Article | 6 December 2004 Paper

Comparative study of mask architectures for EUV lithography

Adam Pawloski, Bruno La Fontaine, Harry Levinson, Stefan Hirscher, Siegfried Schwarzl, Klaus Lowack, Frank-Michael Kamm, Markus Bender, Wolf-Dieter Domke, Christian Holfeld, Uwe Dersch, Patrick Naulleau, Florian Letzkus, Joerg Butschke

Proceedings Volume 5567, (2004) https://doi.org/10.1117/12.569289

KEYWORDS: Photomasks, Multilayers, Extreme ultraviolet lithography, Semiconducting wafers, Extreme ultraviolet, Reflectors, Cadmium, Critical dimension metrology, Photoresist materials, Scanning electron microscopy

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Proceedings Article | 6 December 2004 Paper

Absorber stack optimization toward EUV lithography mask blank pilot production

Frank Sobel, Lutz Aschke, Markus Renno, Holger Seitz, Hans Becker, Nathalie Olschewski, Torsten Reichardt, Guenter Hess, Ute Buttgereit, Konrad Knapp, Florian Letzkus, Joerg Butschke, Corinna Koepernik

Proceedings Volume 5567, (2004) https://doi.org/10.1117/12.568787

KEYWORDS: Coating, Reflectivity, Etching, Extreme ultraviolet, Extreme ultraviolet lithography, Photomasks, Dry etching, Inspection, Manufacturing, Multilayers

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Proceedings Article | 6 December 2004 Paper

SiO2 buffer-etch processes with a TaN absorber for EUV mask fabrication

Florian Letzkus, Joerg Butschke, Corinna Koepernik, Christian Holfeld, Josef Mathuni, Lutz Aschke, Frank Sobel

Proceedings Volume 5567, (2004) https://doi.org/10.1117/12.569265

KEYWORDS: Etching, Photomasks, Silicon, Dry etching, Extreme ultraviolet, Scanning electron microscopy, Semiconducting wafers, Extreme ultraviolet lithography, Chemistry, Mask making

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Proceedings Article | 2 June 2004 Paper

Optimized processes and absorber-stack materials for EUV masks

Josef Mathuni, Jenspeter Rau, Frank-Michael Kamm, Guenther Ruhl, Ch. Holfeld, Florian Letzkus, C. Koepernik, Joerg Butschke

Proceedings Volume 5504, (2004) https://doi.org/10.1117/12.568010

KEYWORDS: Etching, Photomasks, Extreme ultraviolet, Chromium, Tantalum, Critical dimension metrology, Materials processing, Extreme ultraviolet lithography, Reflectivity, Semiconducting wafers

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Proceedings Article | 28 August 2003 Paper

Development of a plasma etch process for TaN absorber patterning on EUV masks

Guenther Ruhl, Josef Mathuni, Dirk Knobloch, Frank-Michael Kamm, Jenspeter Rau, Florian Letzkus, Reinhard Springer

Proceedings Volume 5130, (2003) https://doi.org/10.1117/12.504243

KEYWORDS: Etching, Polymers, Plasma etching, Photomasks, Plasma, Extreme ultraviolet, Scanning electron microscopy, Photoresist processing, Chromium, Diffractive optical elements

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SPIE Journal Paper | 1 January 2003

Large-field particle beam optics for projection and proximity printing and for maskless lithography

Hans Loeschner, Gerhard Stengl, Herbert Buschbeck, A. Chalupka, Gertraud Lammer, Elmar Platzgummer, Herbert Vonach, Patrick de Jager, Rainer Kaesmaier, Albrecht Ehrmann, Stefan Hirscher, Andreas Wolter, Andreas Dietzel, Ruediger Berger, Hubert Grimm, Bruce Terris, Wilhelm Bruenger, Gerhard Gross, Olaf Fortagne, Dieter Adam, Michael Boehm, Hans Eichhorn, Reinhard Springer, Joerg Butschke, Florian Letzkus, Paul Ruchhoeft, John Wolfe

JM3, Vol. 2, Issue 01, (January 2003) https://doi.org/10.1117/12.10.1117/1.1528946

KEYWORDS: Ions, Ion beams, Photomasks, Particle beams, Photodynamic therapy, Maskless lithography, Magnetism, Lithography, Semiconducting wafers, Charged particle optics

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Proceedings Article | 16 August 2002 Paper

Measures to achieve 20nm IPL stencil mask distortion

Ernst Haugeneder, A. Chalupka, T Lammer, Hans Loeschner, Frank-Michael Kamm, Thomas Struck, Albrecht Ehrmann, Rainer Kaesmaier, Andreas Wolter, Joerg Butschke, Mathias Irmscher, Florian Letzkus, Reinhard Springer

Proceedings Volume 4764, (2002) https://doi.org/10.1117/12.479353

KEYWORDS: Photomasks, Semiconducting wafers, Distortion, Silicon, Ion beams, Electrodes, Ions, Wafer bonding, Manufacturing, Projection lithography

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Proceedings Article | 1 August 2002 Paper

Comparative evaluation of e-beam sensitive chemically amplified resists for mask making

Mathias Irmscher, Dirk Beyer, Joerg Butschke, Chris Constantine, Thomas Hoffmann, Corinna Koepernik, Christian Krauss, Bernd Leibold, Florian Letzkus, Dietmar Mueller, Reinhard Springer, Peter Voehringer

Proceedings Volume 4754, (2002) https://doi.org/10.1117/12.476944

KEYWORDS: Photomasks, Semiconducting wafers, Mask making, Line edge roughness, Etching, Silicon, Coating, Chemically amplified resists, Photoresist processing, Chromium

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Proceedings Article | 1 July 2002 Paper

Large-field ion optics for projection and proximity printing and for maskless lithography (ML2)

Hans Loeschner, Gerhard Stengl, Herbert Buschbeck, A. Chalupka, Gertraud Lammer, Elmar Platzgummer, Herbert Vonach, Patrick de Jager, Rainer Kaesmaier, Albrecht Ehrmann, Stefan Hirscher, Andreas Wolter, Andreas Dietzel, Ruediger Berger, Hubert Grimm, Bruce Terris, Wilhelm Bruenger, Dieter Adam, Michael Boehm, Hans Eichhorn, Reinhard Springer, Joerg Butschke, Florian Letzkus, Paul Ruchhoeft, John Wolfe

Proceedings Volume 4688, (2002) https://doi.org/10.1117/12.472336

KEYWORDS: Ions, Magnesium, Lithography, Mendelevium, Printing, Maskless lithography, Neodymium, Nickel, Neon, Ion beams

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Proceedings Article | 20 August 2001 Paper

Progress in placement control for ion beam stencil mask technology

Frank-Michael Kamm, Albrecht Ehrmann, Thomas Struck, Karl Kragler, Joerg Butschke, Florian Letzkus, Reinhard Springer, Ernst Haugeneder

Proceedings Volume 4343, (2001) https://doi.org/10.1117/12.436673

KEYWORDS: Photomasks, Semiconducting wafers, Ions, Etching, Projection lithography, Boron, Carbon, Beam controllers, Ion beams, Optical lithography

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Proceedings Article | 9 April 2001 Paper

Progress in placement control for ion beam stencil mask technology

Frank-Michael Kamm, Albrecht Ehrmann, Thomas Struck, Karl Kragler, Joerg Butschke, Florian Letzkus, Reinhard Springer, Ernst Haugeneder, Artur Degen, Jens Voigt, Martin Kratzenberg, Ivo Rangelow

Proceedings Volume 4349, (2001) https://doi.org/10.1117/12.425098

KEYWORDS: Photomasks, Ions, Semiconducting wafers, Carbon, Oxides, Lithography, Beam controllers, Ion beams, Ion implantation, Deposition processes

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Proceedings Article | 21 July 2000 Paper

Resist technologies for ion projection lithography (IPL) stencil maskmaking

Mathias Irmscher, Joerg Butschke, Klaus Elian, Bernd Hoefflinger, Karl Kragler, Florian Letzkus, Joerg Ochsenhirt, Christian Reuter, Reinhard Springer

Proceedings Volume 3997, (2000) https://doi.org/10.1117/12.390072

KEYWORDS: Etching, Silicon, Carbon, Photomasks, Photoresist processing, Lithography, Ions, Silicon carbide, Mask making, Semiconducting wafers

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Proceedings Article | 21 July 2000 Paper

IPL stencil mask distortions: experimental and theoretical analysis

Albrecht Ehrmann, Thomas Struck, Ernst Haugeneder, Hans Loeschner, Joerg Butschke, Florian Letzkus, Mathias Irmscher, Reinhard Springer

Proceedings Volume 3997, (2000) https://doi.org/10.1117/12.390075

KEYWORDS: Photomasks, Semiconducting wafers, Etching, Silicon, Pellicles, Carbon, Ions, Projection lithography, Quartz, Manufacturing

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Proceedings Article | 21 July 2000 Paper

Stencil mask key parameter measurement and control

Albrecht Ehrmann, Annika Elsner, Roman Liebe, Thomas Struck, Joerg Butschke, Florian Letzkus, Mathias Irmscher, Reinhard Springer, Ernst Haugeneder, Hans Loeschner

Proceedings Volume 3997, (2000) https://doi.org/10.1117/12.390074

KEYWORDS: Photomasks, Silicon, Carbon, Etching, Critical dimension metrology, Inspection, Semiconducting wafers, Silicon carbide, Manufacturing, Particles

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Proceedings Article | 3 February 2000 Paper

Optimization of the e-beam sensitive bilayer CARL process for stencil mask making

Joerg Ochsenhirt, Joerg Butschke, Florian Letzkus, Bernd Hoefflinger, Mathias Irmscher, Christian Reuter, Reinhard Springer, Klaus Elian

Proceedings Volume 3996, (2000) https://doi.org/10.1117/12.377121

KEYWORDS: Silicon, Photoresist processing, Photomasks, Etching, Mask making, Tin, Plasma, Line edge roughness, Statistical analysis, Critical dimension metrology

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Proceedings Article | 30 December 1999 Paper

Placement measurement and FE modeling results for distortion control of stencil masks

Albrecht Ehrmann, Thomas Struck, Rainer Kaesmaier, Ernst Haugeneder, Hans Loeschner, Joerg Butschke, Florian Letzkus, Mathias Irmscher, Reinhard Springer, Roxann Engelstad

Proceedings Volume 3873, (1999) https://doi.org/10.1117/12.373376

KEYWORDS: Photomasks, Semiconducting wafers, Distortion, Silicon, Etching, Electron beam lithography, Oxides, Quartz, Semiconductor lasers, Lamps

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Proceedings Article | 23 April 1999 Paper

PN and SOI wafer flow process for stencil mask fabrication

Joerg Butschke, Albrecht Ehrmann, Ernst Haugeneder, Mathias Irmscher, Rainer Kaesmaier, Karl Kragler, Florian Letzkus, Hans Loeschner, Josef Mathuni, Ivo Rangelow, Carsten Reuter, Feng Shi, Reinhard Springer

Proceedings Volume 3665, (1999) https://doi.org/10.1117/12.346224

KEYWORDS: Etching, Semiconducting wafers, Silicon, Photomasks, Oxides, Electrochemical etching, Metals, Lithography, Ions, Wafer bonding

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Proceedings Article | 18 December 1998 Paper

Stencil mask technology for ion beam lithography

Albrecht Ehrmann, Sabine Huber, Rainer Kaesmaier, Andreas Oelmann, Thomas Struck, Reinhard Springer, Joerg Butschke, Florian Letzkus, Karl Kragler, Hans Loeschner, Ivo Rangelow

Proceedings Volume 3546, (1998) https://doi.org/10.1117/12.332827

KEYWORDS: Photomasks, Semiconducting wafers, Silicon, Ions, Etching, Carbon, Control systems, Ion beam lithography, Lithography, Inspection

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Showing 5 of 39 publications

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