Mr. Guillaume Claveau Profile

Guillaume Claveau

at CEA-LETI

SPIE Involvement:

Author

Publications (10)

Proceedings Article | 19 March 2018 Paper

Precise control of template affinity achieved by UV-assisted graphoepitaxy approach on silicon nanowires applications

P. Pimenta-Barros, G. Claveau, M. Argoud, Z. Chalupa, N. Allouti, C. Comboroure, G. Chamiot-Maitral, N. Posseme, L. Pain, R. Tiron, C. Navarro, C. Nicolet, I. Cayrefourcq

Proceedings Volume 10584, 105840C (2018) https://doi.org/10.1117/12.2297407

KEYWORDS: Etching, Silicon, Ultraviolet radiation, Directed self assembly, Polymethylmethacrylate, Scanning electron microscopy, Plasma, Nanowires, Line width roughness, Surface properties

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Proceedings Article | 10 April 2017 Presentation + Paper

Nanoimprint, DSA, and multi-beam lithography: patterning technologies with new integration challenges

S. Landis, H. Teyssedre, G. Claveau, I. Servin, F. Delachat, M. L. Pourteau, A. Gharbi, P. Pimenta Barros, R. Tiron, L. Nouri, N. Possemé, M. May, P. Brianceau, S. Barnola, Y. Blancquaert, J. Pradelles, P. Essomba, A. Bernadac, B. Dal'zotto, S. Bos, M. Argoud, G. Chamiot-Maitral, A. Sarrazin, C. Tallaron, C. Lapeyre, L. Pain

Proceedings Volume 10149, 101490K (2017) https://doi.org/10.1117/12.2259966

KEYWORDS: Directed self assembly, Lithography, Line width roughness, Nanoimprint lithography, Semiconducting wafers, Etching, Electron beam lithography, System on a chip, Critical dimension metrology, Photoresist processing

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Proceedings Article | 27 March 2017 Paper

DSA process window expansion with novel DSA track hardware

Masahiko Harumoto, Harold Stokes, Yuji Tanaka, Koji Kaneyama, Chalres Pieczulewski, Masaya Asai, Maxime Argoud, Isabelle Servin, Gaëlle Chamiot-Maitral, Guillaume Claveau, Raluca Tiron, Ian Cayrefourcq

Proceedings Volume 10146, 101461X (2017) https://doi.org/10.1117/12.2257945

KEYWORDS: Directed self assembly, Optical lithography, Thin film coatings, Line width roughness, Annealing, Oxygen, Scanning electron microscopy, Atmospheric modeling, Semiconducting wafers, Polymers

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Proceedings Article | 27 March 2017 Presentation + Paper

A high chi track-compatible DSA for sub-10nm L/S patterning

Douglas Guerrero, Kaumba Sakavuyi, Kui Xu, Ahmed Gharbi, Raluca Tiron, Isabelle Servin, Laurent Pain, Guillaume Claveau, Harold Stokes, Masahiko Harumoto, Célia Nicolet, Xavier Chevalier

Proceedings Volume 10146, 101460W (2017) https://doi.org/10.1117/12.2261094

KEYWORDS: Directed self assembly, Annealing, Optical lithography, Polymers, Scanning electron microscopy, Semiconducting wafers, Silicon, Line width roughness, Glasses, Ultraviolet radiation

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Proceedings Article | 21 March 2017 Paper

Latest evolution in a 300mm graphoepitaxy pilot line flow for L/S applications

G. Claveau, M. Argoud, P. Pimenta-Barros, G. Chamiot-Maitral, R. Tiron, X. Chevalier, C. Navarro

Proceedings Volume 10144, 1014411 (2017) https://doi.org/10.1117/12.2257969

KEYWORDS: Self organized materials, Line width roughness, Line edge roughness, Optical lithography, Polymethylmethacrylate, Directed self assembly, Immersion lithography, Etching, Critical dimension metrology, Macromolecules, Applied physics, Ultraviolet radiation, Lithography, Photomasks, 193nm lithography

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SPIE Journal Paper | 25 August 2016

Surface affinity role in graphoepitaxy of lamellar block copolymers

Guillaume Claveau, Patrick Quemere, Maxime Argoud, Jerome Hazart, Patricia Pimenta-Barros, Aurelien Sarrazin, Nicolas Posseme, Raluca Tiron, Xavier Chevalier, Celia Nicolet, Christophe Navarro

JM3, Vol. 15, Issue 03, 031604, (August 2016) https://doi.org/10.1117/12.10.1117/1.JMM.15.3.031604

KEYWORDS: Directed self assembly, Annealing, Polymethylmethacrylate, Line width roughness, Picosecond phenomena, Semiconducting wafers, Lithography, Optical lithography, Image registration, Plasma

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Proceedings Article | 24 March 2016 Paper

Free surface BCP self-assembly process characterization with CDSEM

Shimon Levi, Yakov Weinberg, Ofer Adan, Michael Klinov, Maxime Argoud, Guillaume Claveau, Raluca Tiron

Proceedings Volume 9778, 977815 (2016) https://doi.org/10.1117/12.2218347

KEYWORDS: Directed self assembly, Image segmentation, Semiconducting wafers, Picosecond phenomena, Metrology, Polymethylmethacrylate, Image processing, Diffractive optical elements, Scanning electron microscopy, Materials processing

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Proceedings Article | 23 March 2016 Paper

PMMA removal selectivity to PS using dry etch approach: sub-10nm patterning application

A. Sarrazin, N. Posseme, P. Pimenta Barros, S. Barnola, G. Claveau, A. Gharbi, M. Argoud, G. Chamiot-Maitral, R. Tiron, C. Nicolet, C. Navarro, C. Cardinaud

Proceedings Volume 9782, 97820G (2016) https://doi.org/10.1117/12.2220586

KEYWORDS: Directed self assembly, Polymethylmethacrylate, Chemistry, Picosecond phenomena, Etching, Xenon, Plasma, Carbon monoxide, Plasma etching, Semiconducting wafers

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Proceedings Article | 21 March 2016 Paper

Surface affinity role in graphoepitaxy of lamellar block copolymers

G. Claveau, P. Quemere, M. Argoud, J. Hazart, P. Pimenta Barros, A. Sarrazin, N. Posseme, R. Tiron, X. Chevalier, C. Nicolet, C. Navarro

Proceedings Volume 9779, 97791F (2016) https://doi.org/10.1117/12.2219131

KEYWORDS: Line width roughness, Polymers, Directed self assembly, Optical lithography, Line edge roughness, 193nm lithography, Semiconducting wafers, Statistical analysis, Polymer thin films, Annealing, Polymethylmethacrylate, Lithography, Image registration, Photomasks

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Proceedings Article | 17 March 2015 Paper

DSA planarization approach to solve pattern density issue

P. Pimenta Barros, A. Gharbi, Aurélien Sarrazin, R. Tiron, N. Posseme, S. Barnola, S. Bos, C. Tallaron, G. Claveau, X. Chevalier, M. Argoud, Isabelle Servin, C. Navarro, Célia Nicolet, C. Lapeyre, C. Monget

Proceedings Volume 9428, 94280D (2015) https://doi.org/10.1117/12.2086810

KEYWORDS: Polymethylmethacrylate, Etching, Critical dimension metrology, Picosecond phenomena, Semiconducting wafers, Chemistry, Scanning electron microscopy, Carbon monoxide, Dry etching, Directed self assembly

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Showing 5 of 10 publications

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