Mr. Yoshihiko Fujimori Profile

Yoshihiko Fujimori

at Nikon Corp

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Author

Publications (7)

Proceedings Article | 10 April 2024 Poster + Paper

Technology for high density CD measurement of EUV-processed resist patterns across a wafer ensuring high throughput and precision

Taeko Matsukata, Kazuhiko Fukazawa, Shigeru Hirukawa, Kaori Mukai, Yosuke Miyazaki, Yoshihiko Fujimori, Tomohiro Iwaki, Tomonori Okada

Proceedings Volume 12955, 129552O (2024) https://doi.org/10.1117/12.3010278

KEYWORDS: Semiconducting wafers, Critical dimension metrology, Reflection, Polarized light, Polarization, Image processing, Refractive index

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Proceedings Article | 27 April 2023 Presentation + Paper

High-density CD measurement technology with high throughput and high precision on the entire surface of a process wafer, capable of capturing randomly occurring CD defects

Kazuhiko Fukazawa, Shigeru Hirukawa, Yosuke Miyazaki, Yoshihiko Fujimori, Tomohiro Iwaki, Tomonori Okada

Proceedings Volume 12496, 1249611 (2023) https://doi.org/10.1117/12.2657873

KEYWORDS: Semiconducting wafers, Critical dimension metrology, Diffraction, Error analysis, Signal intensity, Image processing, Etching, Photoresist processing

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SPIE Journal Paper | 29 January 2014

Macroinspection methodology for through silicon via array in three-dimensional integrated circuit

Yoshihiko Fujimori, Takashi Tsuto, Kazuya Okamoto, Kyoichi Suwa, Hiroyuki Tsukamoto

JM3, Vol. 13, Issue 01, 011204, (January 2014) https://doi.org/10.1117/12.10.1117/1.JMM.13.1.011204

KEYWORDS: Diffraction, Semiconducting wafers, Inspection, Silicon, Polarization, Wafer-level optics, Integrated circuits, Signal detection, Wafer testing, Polarizers

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SPIE Journal Paper | 11 February 2013 Open Access

New methodology for through silicon via array macroinspection

Yoshihiko Fujimori, Takashi Tsuto, Yuji Kudo, Takeshi Inoue, Kyoichi Suwa, Kazuya Okamoto

JM3, Vol. 12, Issue 01, 013013, (February 2013) https://doi.org/10.1117/12.10.1117/1.JMM.12.1.013013

KEYWORDS: Semiconducting wafers, Diffraction, Inspection, Silicon, Etching, Wafer-level optics, Wafer testing, Scanning electron microscopy, Near infrared, Signal processing

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Proceedings Article | 20 April 2011 Paper

A new methodology for TSV array inspection

Yoshihiko Fujimori, Takashi Tsuto, Yuji Kudo, Takeshi Inoue, Kazuya Okamoto

Proceedings Volume 7971, 79710I (2011) https://doi.org/10.1117/12.879379

KEYWORDS: Diffraction, Semiconducting wafers, Inspection, Etching, Silicon, Wafer testing, Near infrared, Wafer-level optics, Signal processing, Image sensors

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Proceedings Article | 2 April 2010 Paper

New exposure tool management technology with quick focus measurement in half pitch 22nm generation

Kazuhiko Fukazawa, Toshiaki Kitamura, Shinsuke Takeda, Yoshihiko Fujimori, Yuji Kudo, Shigeru Hirukawa, Kengo Takemasa, Noriaki Kasai, Yuuichiro Yamazaki, Kiminori Yoshino

Proceedings Volume 7638, 763806 (2010) https://doi.org/10.1117/12.846329

KEYWORDS: Semiconducting wafers, Diffraction, Scanners, Reticles, Calibration, Overlay metrology, Wafer-level optics, Critical dimension metrology, Image analysis

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Proceedings Article | 23 March 2009 Paper

Two-dimensional dose and focus-error measurement technology for exposure tool management in half-pitch 3x generation

Kazuhiko Fukazawa, Yuji Kudo, Yoshihiko Fujimori, Kiminori Yoshino, Yuichiro Yamazaki

Proceedings Volume 7272, 72721I (2009) https://doi.org/10.1117/12.813937

KEYWORDS: Line edge roughness, Critical dimension metrology, Semiconducting wafers, Polarization, Inspection, Wafer testing, Scanning electron microscopy, Defect detection, Wafer-level optics

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Showing 5 of 7 publications

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