Presentation
17 March 2023 Fast and wide-angle integrated laser beam scanner enabled by a metalens
Author Affiliations +
Proceedings Volume PC12432, High Contrast Metastructures XII; PC124320Q (2023) https://doi.org/10.1117/12.2649463
Event: SPIE OPTO, 2023, San Francisco, California, United States
Abstract
On-chip integration of metasurfaces with optoelectronic components enables the manufacture of reliable and low-cost systems that do not require post-fabrication alignment and assembly. Here we present an on-chip miniature beam scanning metasystem by integrating a large 2D array of VCSELs and a metalens. The beam scanner measures 4 mm*4 mm*3 mm and scans a ~1 mW laser beam at 940 nm with <1 degree divergence angle over a 140 degree*140 degree field of view with <30 mW of power consumption. The scanner switches between two angles in <1 µs, enabling the realization of fully-integrated miniature imaging lidar systems.
Conference Presentation
© (2023) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Babak Mirzapourbeinekalaye, Mahdad Mansouree, Andrew McClung, and Amir Arbabi "Fast and wide-angle integrated laser beam scanner enabled by a metalens", Proc. SPIE PC12432, High Contrast Metastructures XII, PC124320Q (17 March 2023); https://doi.org/10.1117/12.2649463
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KEYWORDS
3D scanning

Laser scanners

Imaging systems

LIDAR

Optics manufacturing

Scanners

Vertical cavity surface emitting lasers

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