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30 April 2023 The FabSCIL platform: 200 and 300mm double side full wafer NIL
Marc A. Verschuuren, Rob Voorkamp, Mohammad Ramezani, Gert-Jan Hurxkens, Jeroen Visser
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Proceedings Volume PC12497, Novel Patterning Technologies 2023; PC1249709 (2023) https://doi.org/10.1117/12.2658052
Event: SPIE Advanced Lithography + Patterning, 2023, San Jose, California, United States
Abstract
Nanoimprint lithography (NIL) is a technology that can deliver cost effective fabrication of pattern from 10’s of microns, down to sub-micron and nano-patterns (<10nm) on large areas. Substrate Conformal Imprint Lithography (SCIL) solves the limitations of soft-stamp based NIL techniques (resolution, pattern deformation, overlay) and allows low-pressure wafer scale conformal contact and sub-10 nm resolution in direct patterned optically functional inorganic resist systems (RI up to 2.1). Using a novel scatterometry method we verify the reproducible patterning of sub-micron gratings to +/- 1nm. Our latest FabSCIL cluster offers processing of 200 and 300mm wafers, from 300 microns up to 2.5mm thickness, overlay accuracy below 1 micron, even with full automated overlay alignment of patterns directly from the front to the backside of the wafer. In the contribution we will elaborate on the material systems, reproducibility and production solutions.
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Marc A. Verschuuren, Rob Voorkamp, Mohammad Ramezani, Gert-Jan Hurxkens, and Jeroen Visser "The FabSCIL platform: 200 and 300mm double side full wafer NIL", Proc. SPIE PC12497, Novel Patterning Technologies 2023, PC1249709 (30 April 2023); https://doi.org/10.1117/12.2658052
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KEYWORDS
Nanoimprint lithography
Semiconducting wafers
Refractive index
3D modeling
Diffraction
Materials processing
Objectives
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