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An interference method for determination of the thickness of thin dielectric films deposited on metal substrates is described. The method uses the variation of multiple-beam interference of light reflected from the sample as the incident angle is changed. The effects of the phase change on reflection at the metal/dielectric interface are shown to be negligible for a MgF2 film deposited on Chromium. A working instrument is described which uses holographic lenses to obtain the large scan angles required with low aberration. The results obtained with this instrument agree well with those obtained using a Talysurf.
K. Matsuda andM. Namiki
"Laser Interferometric Method For The Measurement Of Film Thickness, Using Holographic Optical Components", Proc. SPIE 0952, Laser Technologies in Industry, (16 January 1988); https://doi.org/10.1117/12.968846
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K. Matsuda, M. Namiki, "Laser Interferometric Method For The Measurement Of Film Thickness, Using Holographic Optical Components," Proc. SPIE 0952, Laser Technologies in Industry, (16 January 1988); https://doi.org/10.1117/12.968846