Board Level High Speed Photonic Interconnections: Recent Technology Developments

David H. Hartman; Gail R. Lalk; Thomas C. Banwell; Ivan Ladany

doi:10.1117/12.960110

9 February 1989 Board Level High Speed Photonic Interconnections: Recent Technology Developments

David H. Hartman, Gail R. Lalk, Thomas C. Banwell, Ivan Ladany

Proceedings Volume 0994, Optoelectronic Materials, Devices, Packaging, and Interconnects II; (1989) https://doi.org/10.1117/12.960110
Event: O-E/Fiber LASE '88, 1988, Boston, MA, United States

Abstract

Board level photonic interconnections offer the potential of enhancing standard high speed electronic systems performance. But, to be successful, significant advances in optoelectronics packaging, physical design and subminiaturization are necessary. This paper addresses these physical design issues. Solutions currently being researched are presented. Technology advances in transmitter, receiver, and optical channel development are reported.

Citation Download Citation

David H. Hartman, Gail R. Lalk, Thomas C. Banwell, and Ivan Ladany "Board Level High Speed Photonic Interconnections: Recent Technology Developments", Proc. SPIE 0994, Optoelectronic Materials, Devices, Packaging, and Interconnects II, (9 February 1989); https://doi.org/10.1117/12.960110

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