Vertical Fiber Coupling For High-Density Optical Interconnection

R. W. Ade; E. R. Fossum; M. A. Tischler

doi:10.1117/12.960107

9 February 1989 Vertical Fiber Coupling For High-Density Optical Interconnection

R. W. Ade, E. R. Fossum, M. A. Tischler

Proceedings Volume 0994, Optoelectronic Materials, Devices, Packaging, and Interconnects II; (1989) https://doi.org/10.1117/12.960107
Event: O-E/Fiber LASE '88, 1988, Boston, MA, United States

Abstract

A GaAs/AIGaAs fiber-optic interconnect structure for high-density applications is discussed. The vertical approach, which employs reactive-ion-etched cavities to couple fibers to the semiconductor substrate, permits interconnect arrays with densities up to 1600 sites/cm2. Factors affecting the applicability of the fiber coupler and the achievable packing density are considered.

Citation Download Citation

R. W. Ade, E. R. Fossum, and M. A. Tischler "Vertical Fiber Coupling For High-Density Optical Interconnection", Proc. SPIE 0994, Optoelectronic Materials, Devices, Packaging, and Interconnects II, (9 February 1989); https://doi.org/10.1117/12.960107

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