Lithography equipment

Harry J. Levinson

doi:10.1117/12.2284081

30 August 2017 Lithography equipment

Harry J. Levinson

Proceedings Volume 10321, Single Frequency Semiconductor Lasers; 1032102 (2017) https://doi.org/10.1117/12.2284081
Event: Tutorial Texts in Optical Engineering Series 1991, 1991, Bellingham, WA, United States

Abstract

Until recently, lithography capability evolved consistently with Moore's law. It appears that semiconductor manufacturers are now deviating from Moore's law, which has implications for lithography equipment. DUV lithography is moving into production in a mix-and-match environment. Step- and-scan technology is the wave of the near- future, as a way to contend with the difficulty of manufacturing wide-field lenses. Resist processing equipment will undergo few fundamental changes, but will often be integrated with steppers, particularly for DUV applications. Metrology is being stretched beyond its limits for technologies below 250 nm. The move is on to 300 =I diameter wafers, and 193 nm lithography is under consideration.

Citation Download Citation

Harry J. Levinson "Lithography equipment", Proc. SPIE 10321, Single Frequency Semiconductor Lasers, 1032102 (30 August 2017); https://doi.org/10.1117/12.2284081

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