Automated lamellar block copolymer process characterization

G. Bernard; X. Chevalier; A. Dervilllé; J. Foucher

doi:10.1117/12.2297347

19 March 2018 Automated lamellar block copolymer process characterization

G. Bernard, X. Chevalier, A. Dervilllé, J. Foucher

Proceedings Volume 10586, Advances in Patterning Materials and Processes XXXV; 105860Z (2018) https://doi.org/10.1117/12.2297347
Event: SPIE Advanced Lithography, 2018, San Jose, California, United States

Abstract

Lamellar CD-SEM image analysis is one of the key step for the development of new polymer formulations. We present in this paper a new approach for the analysis of lamellar CD-SEM that can be extended to any type of other pattern (contact…) with a machine learning approach. We will also focus on the roughness analysis and specifically the Line Edge Roughness (LER) and Power Spectral Density (PSD) with a robust estimation that takes into account curvature of the line. The last part is dedicated to the introduction of a process optimisation technique using machine learning to optimize process parameters from a first design of experiment.

Conference Presentation

Citation Download Citation

G. Bernard, X. Chevalier, A. Dervilllé, and J. Foucher "Automated lamellar block copolymer process characterization ", Proc. SPIE 10586, Advances in Patterning Materials and Processes XXXV, 105860Z (19 March 2018); https://doi.org/10.1117/12.2297347

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available