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16 August 2019 Fully integrated ultra-compact 3D microtube devices (Conference Presentation)
Oliver G. Schmidt
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Proceedings Volume 10958, Novel Patterning Technologies for Semiconductors, MEMS/NEMS, and MOEMS 2019; 1095808 (2019) https://doi.org/10.1117/12.2518395
Event: SPIE Advanced Lithography, 2019, San Jose, California, United States
Abstract
Self-assembled rolled-up microtubes are exploited to rigorously compact 2D devices into 3D microarchitectures. We demonstrate integration of transistors, integrated circuitry as well as electronic, photonic and magnetic components into microtube devices for sensor arrays and novel device platforms such as lab-in-a-tube systems. In combination with self-wound energy storage units our work bridges lengthscales for a new generation of high performance electronic microdevices.
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Oliver G. Schmidt "Fully integrated ultra-compact 3D microtube devices (Conference Presentation)", Proc. SPIE 10958, Novel Patterning Technologies for Semiconductors, MEMS/NEMS, and MOEMS 2019, 1095808 (16 August 2019); https://doi.org/10.1117/12.2518395
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KEYWORDS
Bridges
Electronic components
Integrated circuit design
Integrated circuits
Magnetic sensors
Magnetism
Molecular bridges
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