A challenge present in assessing contamination accumulation on many missions is predicting fallout during ground processing given the multiple and various orientations possible for surfaces such as optics and instruments. The best practice assumption has been to quantify particle build up on vertical surfaces as approximately 1/10 that of horizontal surfaces. There is insufficient data to provide confidence in the 1/10 approximation, yet its use can have a significant effect on mission end of life contamination level predictions, leading to expenditures of precious resources to meet mission requirements. There are many variables influencing the relationship between fallout on vertical and horizontal wafers, including wafer position with respect to air flow, air changes in the facility, duration of exposure, and activity workload. The goal of this continuing study is to develop a tool to inform particulate accumulation predictions for future projects.
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