Poster + Paper
26 May 2022 Automated extraction of critical dimension from SEM with Weave
Author Affiliations +
Conference Poster
Abstract
Current best practices for the extraction of critical dimensions (CDs) from microscopic images requires semiconductor process engineers to analyze images one by one, which is tedious, prone to human bias, time-consuming and expensive. Automated CD extraction using machine learning methodologies is an approach to accelerate and improve the accuracy of this process. Deep learning convolutional neural nets specifically can be used effectively for image segmentation and identification of different material regions; however, providing enough annotated data for training and testing is an ongoing challenge. Here, we demonstrate a method where only one sample image is needed for the neural net to learn how to extract the CDs of interests. The methodology is specifically demonstrated for extracting CDs from a metal assisted chemical etching process. Each experimental SEM image is automatically measured in about 45 seconds. The extracted CD measurements are within 4 nm (<5% error) of the human measured CDs. This automated extraction enables process engineers to improve the accuracy of their metrology workflow, reduce their total metrology costs, and accelerate their process development.
© (2022) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Yang Ban, Bryan Sundahl, Jawad Ahmed, Crystal Barrera, S.V. Sreenivasan, Roger T. Bonnecaze, and Meghali J. Chopra "Automated extraction of critical dimension from SEM with Weave", Proc. SPIE 12053, Metrology, Inspection, and Process Control XXXVI, 1205327 (26 May 2022); https://doi.org/10.1117/12.2614282
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KEYWORDS
Scanning electron microscopy

Image segmentation

Artificial intelligence

Image processing

Image analysis

Process engineering

Metals

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