3-W output power at 2 µm from a flip-chip processed InGaSb VECSEL based on a hybrid metal-semiconductor Bragg reflector

Nicolas Huwyler; Marco Gaulke; Jonas Heidrich; Matthias Golling; Ajanta Barh; Ursula Keller

doi:10.1117/12.2649717

17 March 2023 3-W output power at 2 µm from a flip-chip processed InGaSb VECSEL based on a hybrid metal-semiconductor Bragg reflector

Nicolas Huwyler, Marco Gaulke, Jonas Heidrich, Matthias Golling, Ajanta Barh, Ursula Keller

Author Affiliations +

Proceedings Volume 12404, Vertical External Cavity Surface Emitting Lasers (VECSELs) XII; 1240406 (2023) https://doi.org/10.1117/12.2649717
Event: SPIE LASE, 2023, San Francisco, California, United States

Abstract

The key limiting factor for output power scaling of VECSELs is the thermal resistance of the structure owing to the reflector thickness and the heat conductivity of the semiconductor materials. We have successfully fabricated a flip-chip processed VECSEL emitting at 2 µm using a GaSb/AlAs0.08Sb0.92 hybrid Bragg reflector with 10.5 mirror pairs and a 100–nm copper layer. The flip-chip processed VECSEL reaches a record high continuous wave average output power of 3 W. The device thickness is reduced by 2.5 µm (36%) compared to the standard 19.5 layer semiconductor-only Bragg reflector design.

Conference Presentation

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Nicolas Huwyler, Marco Gaulke, Jonas Heidrich, Matthias Golling, Ajanta Barh, and Ursula Keller "3-W output power at 2 µm from a flip-chip processed InGaSb VECSEL based on a hybrid metal-semiconductor Bragg reflector", Proc. SPIE 12404, Vertical External Cavity Surface Emitting Lasers (VECSELs) XII, 1240406 (17 March 2023); https://doi.org/10.1117/12.2649717

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