Paper
1 November 2022 Curvilinear mask process correction: status quo and outlook
Ingo Bork, Peter Buck, Kushlendra Mishra, Rachit Sharma, Mary Zuo
Author Affiliations +
Proceedings Volume 12472, 37th European Mask and Lithography Conference; 124720S (2022) https://doi.org/10.1117/12.2640001
Event: 37th European Mask and Lithography Conference, 2022, Leuven, Belgium
Abstract
Due to the increasing availability of Multi Beam Mask Writers (MBMW) and the associated wafer lithography benefits, efficient handling of curvilinear mask shapes in the post tape-out flow becomes increasingly important. The presence of complex curvilinear mask shapes generated by Inverse Lithography Technology (ILT), or similar techniques requires new features and algorithms, especially in the context of applying Mask Process Correction (MPC). This paper discusses the status of Curvilinear Mask Process Correction (CLMPC) and gives a brief outlook into the near future of handling curvilinear mask shapes in the post tape-out flow. A summary of MRC requirements for incoming data and implications for mask inspection are included as well to put CLMPC into the right context. Further, approaches for CLMPC file size compaction along with new methods of data representation based on native curve formats are also discussed.
© (2022) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Ingo Bork, Peter Buck, Kushlendra Mishra, Rachit Sharma, and Mary Zuo "Curvilinear mask process correction: status quo and outlook", Proc. SPIE 12472, 37th European Mask and Lithography Conference, 124720S (1 November 2022); https://doi.org/10.1117/12.2640001
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KEYWORDS
Photomasks

Calibration

SRAF

Manufacturing

Optical proximity correction

Scanning electron microscopy

Process modeling

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