Paper
3 February 2023 Sensitivity analysis on diameter measuring system for cylindrical workpiece by laser shadow method
Chenhao Xue, Mingxue Bi, Hongda Li
Author Affiliations +
Proceedings Volume 12511, Third International Conference on Computer Vision and Data Mining (ICCVDM 2022); 125111U (2023) https://doi.org/10.1117/12.2660097
Event: Third International Conference on Computer Vision and Data Mining (ICCVDM 2022), 2022, Hulun Buir, China
Abstract
In order to investigate the influence of main design parameters on the sensitivity of the measuring system, this paper gives the expressions of sensitivity in both x and y directions based on two sets of mutually perpendicular measurement devices, and selects the position of the laser source, the position of the measuring center and the position of workpiece as the main parameters affecting the measuring results, establishes the functional relationship between the sensitivity of workpiece diameter and the above parameters, and analyzes the influence of the sensitivity of the above parameters by using simulation. The results show that, the diameter measuring values are most sensitive to the offset of the workpiece position; it can decrease the sensitivity of the system to the parameters and improve the anti-interference performance of the measurement system by increasing the distance between the laser source position and the linear array CCD appropriately or making the measurement center close to the CCD panel.
© (2023) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Chenhao Xue, Mingxue Bi, and Hongda Li "Sensitivity analysis on diameter measuring system for cylindrical workpiece by laser shadow method", Proc. SPIE 12511, Third International Conference on Computer Vision and Data Mining (ICCVDM 2022), 125111U (3 February 2023); https://doi.org/10.1117/12.2660097
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KEYWORDS
Laser sources

Charge-coupled devices

Optical simulations

Laser systems engineering

Distance measurement

Image processing

Optical testing

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