Displacement Talbot lithography process simulation analysis

Andrew M. C. Dawes; Zhixin Wang; Lawrence S. Melvin III; Bernd Kuechler; Wolfgang Demmerle; Al Blais; Kelsey Wooley; Harun H. Solak

doi:10.1117/12.2690860

21 November 2023 Displacement Talbot lithography process simulation analysis

Andrew M. C. Dawes, Zhixin Wang, Lawrence S. Melvin III, Bernd Kuechler, Wolfgang Demmerle, Al Blais, Kelsey Wooley, Harun H. Solak

Author Affiliations +

Proceedings Volume 12751, Photomask Technology 2023; 127510C (2023) https://doi.org/10.1117/12.2690860
Event: SPIE Photomask Technology + EUV Lithography, 2023, Monterey, California, United States

Abstract

Displacement Talbot Lithography (DTL) is an emerging photolithography technique for printing high-resolution periodic patterns. The image recorded through the DTL process differs from those created in projection printing or contact/proximity techniques, not only because it uses all longitudinal axis image planes, but also in the way the object (mask) transmission function is transformed into the recorded image. We present the main parameters involved in modeling the DTL patterning process and give examples relevant to applications such as AR/VR waveguide production. We also compare DTL to simulated projection lithography implementations. Like the well-known projection lithography case, the ability to accurately model and predict printing results is essential to exploring the process limits and possibilities with this new exposure technique.

Conference Presentation

(2023) Published by SPIE. Downloading of the abstract is permitted for personal use only.

Citation Download Citation

Andrew M. C. Dawes, Zhixin Wang, Lawrence S. Melvin III, Bernd Kuechler, Wolfgang Demmerle, Al Blais, Kelsey Wooley, and Harun H. Solak "Displacement Talbot lithography process simulation analysis", Proc. SPIE 12751, Photomask Technology 2023, 127510C (21 November 2023); https://doi.org/10.1117/12.2690860

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