Research on the effect of different CuO content on the electrical properties of doped AgCuO

Yibo You; Jie Li; Xiaofang Yan; Yangfang Chen; Junkai Ye; Xipeng Wan

doi:10.1117/12.3047099

27 September 2024 Research on the effect of different CuO content on the electrical properties of doped AgCuO

Yibo You, Jie Li, Xiaofang Yan, Yangfang Chen, Junkai Ye, Xipeng Wan

Proceedings Volume 13261, Tenth International Conference on Mechanical Engineering, Materials, and Automation Technology (MMEAT 2024); 1326133 (2024) https://doi.org/10.1117/12.3047099
Event: 10th International Conference on Mechanical Engineering, Materials, and Automation Technology (MMEAT 2024), 2024, Wuhan, China

Abstract

Four AgCuO contact materials with different CuO contents were prepared using atomization technology. The electrical performance parameters of these four materials, including electrical life, welding force, arc energy, and arc burning time, were tested under AC250V and 25 A resistive load conditions using simulated electrical performance testing equipment. The test results and the surface arc erosion morphology of the contacts after the test were analyzed. Research has found that as the CuO content increases, the arc energy and arc time of the contact material gradually decrease, and the anti fusion welding performance gradually increases. Although it may lead to changes in the physical properties of the material, it greatly helps to improve the anti fusion welding performance of the material, thus reducing its impact on the material's performance; The addition of CuO is beneficial for suppressing material transfer and splashing. When the amount of CuO added is 15%, the surface burn morphology and electrical performance parameters of the material are better.

(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.

Citation Download Citation

Yibo You, Jie Li, Xiaofang Yan, Yangfang Chen, Junkai Ye, and Xipeng Wan "Research on the effect of different CuO content on the electrical properties of doped AgCuO", Proc. SPIE 13261, Tenth International Conference on Mechanical Engineering, Materials, and Automation Technology (MMEAT 2024), 1326133 (27 September 2024); https://doi.org/10.1117/12.3047099

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Resistance

Copper

Silver

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Materials properties

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