High-density interconnect technology for VAX 9000 system

Ujwal A. Deshpande; Gelston Howell; Shamouil Shamouilian

doi:10.1117/12.25614

1 April 1991 High-density interconnect technology for VAX 9000 system

Ujwal A. Deshpande, Gelston Howell, Shamouil Shamouilian

Proceedings Volume 1390, Microelectronic Interconnects and Packages: System and Process Integration; (1991) https://doi.org/10.1117/12.25614
Event: Advances in Intelligent Robotics Systems, 1990, Boston, MA, United States

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Ujwal A. Deshpande, Gelston Howell, and Shamouil Shamouilian "High-density interconnect technology for VAX 9000 system", Proc. SPIE 1390, Microelectronic Interconnects and Packages: System and Process Integration, (1 April 1991); https://doi.org/10.1117/12.25614

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