High-density multichip interconnect: military packaging for the 1990s

Philip A. Trask

doi:10.1117/12.25579

1 April 1991 High-density multichip interconnect: military packaging for the 1990s

Philip A. Trask

Proceedings Volume 1390, Microelectronic Interconnects and Packages: System and Process Integration; (1991) https://doi.org/10.1117/12.25579
Event: Advances in Intelligent Robotics Systems, 1990, Boston, MA, United States

Abstract

The history of the integrated circuit has shown that complexity can increase while cost per function decreases. The driving force behind the development of Multi-Chip Modules (MCM) for use in the military environment is primarily one of reduction in system volume and weight. As has been the case with IC''s monolithic integration improves the overall system reliability through a reduction in the number of wirebonds increases the system operating speed through a reduction in propagation delay resulting from much shorter interconnects and reduces the overall system cost per function by eliminating the cost of assembly of the subassembly packages. The successful implementation of High Density Multi- Chip Interconnect (HDMI) technology requires a system level approach to packaging which mandates that the system designer take into account the interface between integrated circuits and the package matching impedance to achieve the best possible system performance. Large HDMI substrate designs have been produced which replace older printed wiring board technology with a significant reduction in system volume and weight and at a reduced cost per function when compared to the older methodology.

Citation Download Citation

Philip A. Trask "High-density multichip interconnect: military packaging for the 1990s", Proc. SPIE 1390, Microelectronic Interconnects and Packages: System and Process Integration, (1 April 1991); https://doi.org/10.1117/12.25579

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