Processing and materials issues for the fabrication of Si/Sii_Ge/Si heterojunction
bipolar transistors (HBTs) are discussed, particularly as they relate to the use of rapid
thermal processing techniques. The addition of Ge to the base of the bipolar transistor
provides the ability to tailor the bandgap throughout the device for optimum performance.
However, these devices pose several challenging process integration issues. The
sensitivity of device performance to temperature-time exposure originates from fundamental processes such as islanding during growth and annealing, impurity incorporation
in Sii_Ge, dopant diffusion in and from Sii_Ge layers, and the formation of misfit
dislocations. Each of these issues sets constraints on processing variables such as temperature,
time, and ambient purity, and on device design parameters such as Ge and dopant
depth profiles. Rapid thermal processing techniques may offer advantages in several of
these areas.
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