Negative resists for i-line lithography utilizing acid-catalyzed intramolecular dehydration reaction

Takumi Ueno; Shou-ichi Uchino; Keiko T. Hattori; Toshihiko Onozuka; Seiichiro Shirai; Noboru Moriuchi; Michiaki Hashimoto; S. Koibuchi

doi:10.1117/12.175334

16 May 1994 Negative resists for i-line lithography utilizing acid-catalyzed intramolecular dehydration reaction

Takumi Ueno, Shou-ichi Uchino, Keiko T. Hattori, Toshihiko Onozuka, Seiichiro Shirai, Noboru Moriuchi, Michiaki Hashimoto, S. Koibuchi

Author Affiliations +

Proceedings Volume 2195, Advances in Resist Technology and Processing XI; (1994) https://doi.org/10.1117/12.175334
Event: SPIE's 1994 Symposium on Microlithography, 1994, San Jose, CA, United States

Abstract

Chemical amplification negative resist system composed of a novolak resin, a carbinol and an acid generator is investigated for i-line phase-shift lithography. The reaction in this resist is based on an acid-catalyzed intramolecular dehydration reaction. The dehydration products act as aqueous-base dissolution inhibitors, and carbinol compounds in unexposed areas work as dissolution promoters. The resist composed of a novolak resin, 1,4-bis((alpha) -hydroxyisopropyl) benzene (DIOL-1) and 2- naphthoylmethyltetramethylenesulfonium triflate (PAG-2) gives the best lithographic performance in terms of sensitivity and resolution. Line-and-space patterns of 0.275 micrometers are obtained using an i-line stepper (NA:0.45) in conjunction with a phase shifting mask.

Citation Download Citation

Takumi Ueno, Shou-ichi Uchino, Keiko T. Hattori, Toshihiko Onozuka, Seiichiro Shirai, Noboru Moriuchi, Michiaki Hashimoto, and S. Koibuchi "Negative resists for i-line lithography utilizing acid-catalyzed intramolecular dehydration reaction", Proc. SPIE 2195, Advances in Resist Technology and Processing XI, (16 May 1994); https://doi.org/10.1117/12.175334

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