Paper
22 September 1995 Process equipment particle control for yield improvement
Kiyoshi Mori, Nam Nguyen, JoAnn Kantapit
Author Affiliations +
Abstract
Particles from process equipment have serious effects on the yield and profitability of a manufacturing facility. With a more advanced inspection tool, more particles are detected, but it is too costly to try to eliminate them all. It is necessary to identify the sources of the highest yield-killing defects to prioritize the efforts for effective yield improvement. This paper reviews the causes of process equipment particle and discusses the strategies and methodologies to achieve the goal of particle reduction for effective yield improvement.
© (1995) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Kiyoshi Mori, Nam Nguyen, and JoAnn Kantapit "Process equipment particle control for yield improvement", Proc. SPIE 2635, Microelectronic Manufacturing Yield, Reliability, and Failure Analysis, (22 September 1995); https://doi.org/10.1117/12.221433
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KEYWORDS
Particles

Semiconducting wafers

Inspection

Yield improvement

Process control

Inspection equipment

Compound parabolic concentrators

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