Contaminant sources causing non-stick-on-pad during die bonding

Dan E. Posey; Tim Z. Hossain

doi:10.1117/12.284679

2 September 1997 Contaminant sources causing non-stick-on-pad during die bonding

Dan E. Posey, Tim Z. Hossain

Proceedings Volume 3215, In-Line Characterization Techniques for Performance and Yield Enhancement in Microelectronic Manufacturing; (1997) https://doi.org/10.1117/12.284679
Event: Microelectronic Manufacturing, 1997, Austin, TX, United States

Abstract

A common problem in die bonding is the non-stick-on-pad (NSOP) when the bond does not pass the pull test. Contaminants are a possible cause of NSOP, particularly if an undesired thick film is developed on the bond pads. Such films effectively diminish the bondability of the pads resulting in a NSOP problem. In one such case Fourier Transform Infra-Red (FTIR) spectroscopy was used to fingerprint the contaminant formed on the bond pads. The contaminant was an aluminum-oxygen-fluorine compound that was very resistant. FTIR showed Al-F bonds and water of hydration. The distinctive chemical signature was critical in solving the NSOP problem quickly. This was accomplished by growing the resistant film under accelerated conditions, thus recreating the compound in the laboratory. Although the chemical compound was not fully identified, the FTIR signature provided confirmation of the compound for various conditions under which it was formed on bond pads. The source of the fluorine was identified and eliminated.

Citation Download Citation

Dan E. Posey and Tim Z. Hossain "Contaminant sources causing non-stick-on-pad during die bonding", Proc. SPIE 3215, In-Line Characterization Techniques for Performance and Yield Enhancement in Microelectronic Manufacturing, (2 September 1997); https://doi.org/10.1117/12.284679

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