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Microsuspensions are very useful mechanical structures in microelectromechanical systems. The fabrication processes of microsuspensions, including front-side etching and back-side etching processes, have been studied extensively. Due to the restriction of undercutting process, the front-side etching approach offers only limited patterns of microsuspension. The present study intends to develop a method to predict the possibility of fabricating microsuspensions on a (100) substrate through front-side etching process. According to the proposed method, microsuspensions with arbitrary shapes can be designed easily. It is found that the formation of the microsuspensions predicted by the proposed technique agrees well with the experimental observation. The contribution of this paper is to provide a convenient tool to design microsuspensions fabricated through front-side etching process. The application of front-side etching process on microsuspensions will become more attractive. Thus the problems of having a large cavity on substrate, longer etching time, and larger die size leaded by the back-side etching process can be prevented.
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