Paper
8 June 1998 Subnanometer-precision metrology for 100-nm gate linewidth control
Kevin M. Monahan, Craig W. MacNaughton, Waiman Ng, Herschel M. Marchman, Jerry E. Schlesinger
Author Affiliations +
Abstract
The 0.13 micrometer semiconductor manufacturing generation will have transistor gate structures as small as 100 nm, creating a demand for 10 nm gate linewidth control and for measurement precision on the order of 2 nm. This process control requirement is inherently long-term. Therefore, measurement equipment should be able to run days or weeks without significant excursions. The requirement for long-term precision drives both the design and use of measurement equipment. We have found that long-term measurement precision on a single tool may be divided into orthogonal components corresponding to static repeatability, short-term dynamic reproducibility, and long-term stability of the tool. The static component is limited primarily by signal-to-noise ratio, the dynamic component is limited primarily by sample positioning and focusing, and the long-term component is limited primarily by instrument drift and, in the case of monitor wafers, aging of the sample. In this work, we show that each of these components can be reduced to less than 1 nm, 3-sigma, for CD SEM measurements of etched polysilicon gate structures.
© (1998) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Kevin M. Monahan, Craig W. MacNaughton, Waiman Ng, Herschel M. Marchman, and Jerry E. Schlesinger "Subnanometer-precision metrology for 100-nm gate linewidth control", Proc. SPIE 3332, Metrology, Inspection, and Process Control for Microlithography XII, (8 June 1998); https://doi.org/10.1117/12.308721
Lens.org Logo
CITATIONS
Cited by 1 scholarly publication.
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Critical dimension metrology

Line scan image sensors

Scanning electron microscopy

Process control

Metrology

Semiconducting wafers

Contamination

Back to Top