Defect data analysis for reticle inspection

Ming-Huei Lin; Shen Chung Kuo

doi:10.1117/12.328832

1 September 1998 Defect data analysis for reticle inspection

Ming-Huei Lin, Shen Chung Kuo

Proceedings Volume 3412, Photomask and X-Ray Mask Technology V; (1998) https://doi.org/10.1117/12.328832
Event: Photomask Japan '98 Symposium on Photomask and X-Ray Mask Technology V, 1998, Kawasaki City, Japan

Abstract

When the IC design rule goes down to 0.25 micrometers or smaller, it brings many more difficulties in reticle manufacturing and inspection. For reticle inspection, the challenges come from the accuracy and sensitivity of inspection machines and defect classifications by the operators. In past few years, based on multiple inspection tools, TMC had developed the defect reviewing system to collect all inspection data and monitor/analyze them. The purpose is to integrate the scanning results from multiple machines and compensate for the loss of human judgments. This integrated methodology not only compares the defect locations among different machines and multiple scans, but also provides the statistics information to help us control the reticle quality.

Citation Download Citation

Ming-Huei Lin and Shen Chung Kuo "Defect data analysis for reticle inspection", Proc. SPIE 3412, Photomask and X-Ray Mask Technology V, (1 September 1998); https://doi.org/10.1117/12.328832

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