Paper
1 September 1998 Possibility of a spin cup method
Terumasa Tokimitsu
Author Affiliations +
Abstract
In reticle manufacturing process, error budget of CD uniformity includes error components caused from material process, exposure system, mask process and measurement technology. We examined error source coming from material process. In the previous paper, the variation of resists thickness was not so dominant to affect CD variation. But it is clear that the variation of resist thickness deeply affects CD linearity. We found that the variation of resists thickness is related to repeatability of fine patterns making such as an OPC structure. Because feature size of OPC patterns are almost as same as the smallest pattern size to be realized by current exposure systems.In this report we will show a method which is called 'spin cup' to achieve the sophisticated design for mask making as a resist coating machine maker. We hope it will be a solution to make mask which has highly accurate resist thickness.
© (1998) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Terumasa Tokimitsu "Possibility of a spin cup method", Proc. SPIE 3412, Photomask and X-Ray Mask Technology V, (1 September 1998); https://doi.org/10.1117/12.328801
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KEYWORDS
Coating

Photomasks

Manufacturing

Materials processing

Critical dimension metrology

Photoresist processing

Coating equipment

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