Paper
19 August 1999 Computational analysis of embedded droplet impingement for integrated cooling of electronics
Chi-fu Wu, Jayathi Y. Murthy, S. C. Yao
Author Affiliations +
Proceedings Volume 3877, Microfluidic Devices and Systems II; (1999) https://doi.org/10.1117/12.359347
Event: Symposium on Micromachining and Microfabrication, 1999, Santa Clara, CA, United States
Abstract
An embedded droplet impingement device is being designed for cooling electronic chip packages which utilizes the latent heat of vaporization of dielectric coolants and provides adaptive on-demand cooling. The device must generate micro- droplets in the 50 - 250 micron range and must be small enough to be embedded in the chip package. A simplex swirl atomizer is one of the designs being considered to generate the spray. This numerical study investigates the design and performance of a micro-scale simplex swirl atomizer. Alternative atomizer designs are considered, and the flow field inside the atomizer is computed over a range of operating parameters. Local and global flow quantities, including exit swirl velocity and pressure profiles, as well as overall pressure drop parameters are computed to characterize alternative designs. These indices are useful in predicting spray quality and in identifying important geometric variables.
© (1999) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Chi-fu Wu, Jayathi Y. Murthy, and S. C. Yao "Computational analysis of embedded droplet impingement for integrated cooling of electronics", Proc. SPIE 3877, Microfluidic Devices and Systems II, (19 August 1999); https://doi.org/10.1117/12.359347
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KEYWORDS
Liquids

Electronics

Dielectrics

Heat flux

Numerical simulations

Protactinium

Silicon

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