Thermal characterization of tape BGA package by modeling

Jiang-Bo Han

doi:10.1117/12.404880

23 October 2000 Thermal characterization of tape BGA package by modeling

Jiang-Bo Han

Proceedings Volume 4229, Microelectronic Yield, Reliability, and Advanced Packaging; (2000) https://doi.org/10.1117/12.404880
Event: International Symposium on Microelectronics and Assembly, 2000, Singapore, Singapore

Abstract

In microelectronic industry, numerical modeling is an effective way to predict thermal performance of IC packages in the initial development stage. Moreover, thermal simulation can provide a greater understanding of the physics of the problem, allowing design to be optimized quickly and cheaply, thereby shortening packaging development cycle time and keeping expensive experimental measurements to a minimum. In this study, 3D finite element analysis (FEA) thermal models capturing the details of the solder ball and internal structure of the tap BGA package are developed. Accuracy of the developed FEA models is validated by bench marking with the measurement for 35mm by 35mm 352 TBGA package. Numerical results of the thermal performance of the TBGA package under various die size and heat-spreader remaining thickness are presented. The thermal metrics, Theta-JA, Psi-JT, and Psi-JB, of the package are characterized numerically. Relationships between these three thermal metrics are established. These relationships are useful to correlate one thermal parameter of the package to another.

Citation Download Citation

Jiang-Bo Han "Thermal characterization of tape BGA package by modeling", Proc. SPIE 4229, Microelectronic Yield, Reliability, and Advanced Packaging, (23 October 2000); https://doi.org/10.1117/12.404880

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