Paper
14 June 2001 Flex-Patch: a highly flexible piezoceramic composite with attached electrical leads
Garnett C. Horner, John Teter, Eugene Robbins
Author Affiliations +
Abstract
A new packaging technique for piezoceramic wafers is presented in which encapsulation of the piezoceramic incorporates the electrical leads. This technique for encapsulation produces a hermetically sealed package that also is flexible. The resulting product is called Flex-Patch because of the high flexibility. Micro-graphs of the flexed piezoceramic show that despite micro-cracking within the ceramic there is little, if any, loss in performance. Flex-Patch may be surface mounted or embedded into composites.
© (2001) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Garnett C. Horner, John Teter, and Eugene Robbins "Flex-Patch: a highly flexible piezoceramic composite with attached electrical leads", Proc. SPIE 4332, Smart Structures and Materials 2001: Industrial and Commercial Applications of Smart Structures Technologies, (14 June 2001); https://doi.org/10.1117/12.429665
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CITATIONS
Cited by 1 scholarly publication.
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KEYWORDS
Composites

Lead

Semiconducting wafers

Ferroelectric materials

Ceramics

Coating

Nickel

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