Paper
18 June 1984 Automatic X-Ray Alignment System For Submicron VLSI Printing
B Fay, W T Novak, I Carlsson
Author Affiliations +
Abstract
An automatic, tri-field registration system is described, as used in an automatic wafer exposure system2, for wafers up to 100 mm diameter featuring a high power stationary anode X-ray source (Pd target). The system provides automatic registration and run out compensation based upon the use of Fresnel zone plate alignment targets. First, the basic concepts of the alignment method using circular Fresnel zone plates are presented. The complete alignment system is then described including machine hardware, software, and system operation. Finally, system results of overlay performance obtained with the registration system are given.
© (1984) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
B Fay, W T Novak, and I Carlsson "Automatic X-Ray Alignment System For Submicron VLSI Printing", Proc. SPIE 0471, Electron-Beam, X-Ray, and Ion-Beam Techniques for Submicrometer Lithographies III, (18 June 1984); https://doi.org/10.1117/12.942331
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Semiconducting wafers

Photomasks

Optical alignment

X-rays

Automatic alignment

Distortion

Lithography

RELATED CONTENT

Advanced X-Ray Alignment System
Proceedings of SPIE (June 30 1986)
The Time Has Come For X-Ray Lithography
Proceedings of SPIE (June 20 1985)
Current status of the SR stepper development
Proceedings of SPIE (July 28 1997)
Recent lithographic results from LEEPL
Proceedings of SPIE (August 28 2003)
Overview of ASET PXL and EUVL programs in Japan
Proceedings of SPIE (July 21 2000)

Back to Top