Hot embossing of microstructures with integrated conduction paths for the production of lab-on-chip systems

Mathias Heckele; Frank Anna

doi:10.1117/12.462869

19 April 2002 Hot embossing of microstructures with integrated conduction paths for the production of lab-on-chip systems

Mathias Heckele, Frank Anna

Author Affiliations +

Proceedings Volume 4755, Design, Test, Integration, and Packaging of MEMS/MOEMS 2002; (2002) https://doi.org/10.1117/12.462869
Event: Symposium on Design, Test, Integration, and Packaging of MEMS/MOEMS 2002, 2002, Cannes-Mandelieu, France

Abstract

Hot embossing allows directly integrating conduction paths made of gold in the channel structures required for applications in lab-on-chip systems. In experiments, ditch depths of more than 100 micrometers wide and 2-3 micrometers thick construction paths. It turned out to be of no relevance whether the inclination of the lateral walls was 45 degree(s) or 90 degree(s).

Citation Download Citation

Mathias Heckele and Frank Anna "Hot embossing of microstructures with integrated conduction paths for the production of lab-on-chip systems", Proc. SPIE 4755, Design, Test, Integration, and Packaging of MEMS/MOEMS 2002, (19 April 2002); https://doi.org/10.1117/12.462869

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