Paper
10 September 2002 Wafer lever packaging for gyroscope by Au/Si eutectic bonding
Yong Ruan, Dacheng Zhang, Zhenchuan Yang, Xiang Wang, Xiaomei Yu
Author Affiliations +
Abstract
This paper will focus on Au/Si eutectic bonding technology. We have set up and improved some MEMS models concerning this technique for discussion. Annealing temperature on bonding was also taken into consideration. Since hydrophilic surface has a large number of —OH groups, which can make two wafers in contact, we derive a hydrophilic surface from dipping the wafer in H2O /H202/NH4OH solution. Especially we use MEMS models with ANSYS to simulate and guide the fabrication of MEMS device. Furthermore, we have improved MEMS structure. Because its bonding temperature, voltage and pressure are low, by using the following technique we could get high density and more reliable MEMS device. We also have used this technology to fabricate gyroscope and some other MEMS devices. Classical Au/Si fusion bonding at 1000°C, and anodic at 450°C is not a commercially feasible process. We achieved AU/Si eutectic bonding technology for gyroscope and other MEMS device manufacture.
© (2002) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Yong Ruan, Dacheng Zhang, Zhenchuan Yang, Xiang Wang, and Xiaomei Yu "Wafer lever packaging for gyroscope by Au/Si eutectic bonding", Proc. SPIE 4928, MEMS/MOEMS Technologies and Applications, (10 September 2002); https://doi.org/10.1117/12.483165
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Silicon

Microelectromechanical systems

Semiconducting wafers

Gold

Packaging

Gyroscopes

Sensors

RELATED CONTENT

Silicon on insulator inertial MEMS device processing
Proceedings of SPIE (January 23 2006)
Wafer-level vacuum/hermetic packaging technologies for MEMS
Proceedings of SPIE (February 04 2010)
Characterization of glass on electronics in MEMS
Proceedings of SPIE (September 03 1999)
Future trends in electronic packaging
Proceedings of SPIE (March 31 2006)

Back to Top