Mask cost and specification

Hisashi Watanabe; Iwao Higashikawa

doi:10.1117/12.537878

17 December 2003 Mask cost and specification

Hisashi Watanabe, Iwao Higashikawa

Proceedings Volume 5256, 23rd Annual BACUS Symposium on Photomask Technology; (2003) https://doi.org/10.1117/12.537878
Event: Photomask Technology, 2003, Monterey, California, United States

Abstract

At the panel discussion of Photomask Japan 2003, we discussed about Mask cost and specification. The topics are (1) Mask price trend and its impact, (2) How to reduce the mask costs; solutions from a mask shop, mask writing tool and mask inspection tool 3) Partnering mask suppliers with mask users; reasonable mask specification and OPC strategies. The choice of DUV laser writer instead of e-beam writer is one solution for reduction of mask cost. The continuous improvement of e-beam writer and resist sensitivity for high throughput is another solution. The partnership between designer, EDA vender, mask maker and wafer lithographer becomes more important.

Citation Download Citation

Hisashi Watanabe and Iwao Higashikawa "Mask cost and specification", Proc. SPIE 5256, 23rd Annual BACUS Symposium on Photomask Technology, (17 December 2003); https://doi.org/10.1117/12.537878

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available