High-precision on-machine 3D shape measurement using hypersurface calibration method

Taeho Ha; Yasuhiro Takaya; Takashi Miyoshi; Shingo Ishizuka; Tatsuhiko Suzuki

doi:10.1117/12.571001

25 October 2004 High-precision on-machine 3D shape measurement using hypersurface calibration method

Taeho Ha, Yasuhiro Takaya, Takashi Miyoshi, Shingo Ishizuka, Tatsuhiko Suzuki

Author Affiliations +

Proceedings Volume 5603, Machine Vision and its Optomechatronic Applications; (2004) https://doi.org/10.1117/12.571001
Event: Optics East, 2004, Philadelphia, Pennsylvania, United States

Abstract

We present a high-precision fringe pattern projection technique based on a novel 4D hypersurface calibration method, and its application to on-machine measurement of raw-stocks in die-making industry. Our fringe pattern projection technique has the following feature. In the calibration stage, coordinates (x, y) of a CCD image sensor correspond uniquely, for every calibration plane with height Z_i (i=1,..,n), to a phase φ of a projected fringe pattern, and coordinates (X , Y) of a machine tool. These relationships are converted to hypersurfaces in 4D spaces of (x, y, Z, φ), (x, y, Z, X), and (x, y, Z, Y), which are considered to be a sort of function. Using these hypersurfaces, a measured data of (x, y, φ) is transformed to machine tool coordinates (X, Y, Z). Our hypersurface calibration method is expected to minimize systematic errors, because it inputs an observed data (x, y, φ) into precise interpolation functions created using actual measurement data, and accordingly systematic errors are cancelled. The repeatability, systematic errors, and random errors obtained from the experiment show that our measurement system has a potential for highly accurate non-contact 3D shape measurement.

Citation Download Citation

Taeho Ha, Yasuhiro Takaya, Takashi Miyoshi, Shingo Ishizuka, and Tatsuhiko Suzuki "High-precision on-machine 3D shape measurement using hypersurface calibration method", Proc. SPIE 5603, Machine Vision and its Optomechatronic Applications, (25 October 2004); https://doi.org/10.1117/12.571001

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