Paper
8 May 2007 Ultrafast phase transition of Si by femtosecond laser pulse irradiation
Masayuki Fujita, Yusaku Izawa, Masaki Hashida, Yuichi Setsuhara, Yasukazu Izawa, Chiyoe Yamanaka
Author Affiliations +
Proceedings Volume 6346, XVI International Symposium on Gas Flow, Chemical Lasers, and High-Power Lasers; 63463S (2007) https://doi.org/10.1117/12.739427
Event: XVI International Symposium on Gas Flow, Chemical Lasers, and High-Power Lasers, 2006, Gmunden, Austria
Abstract
Ablation and amorphization of crystalline Si by ultrashort pulse laser irradiation is reported in this paper. Laser pulse width was changed in the range of 100fs-200ps. We investigated the dependences of ablation rate and fluence for amorphization on laser pulse width. From the dependence of ablation rate, we derived the "effective" light penetration depth, which was much shorter than that calculated from spectroscopic data. At the lower fluence than single shot ablation threshold, femtosecond laser irradiation induced amorphization of crystalline Si. Thickness of the amorphoized layer, which was about 50nm and almost uniform, did not depend on the number of irradiated laser pulses and fluence. The interaction process was investigated by an imaging pump-probe technique.
© (2007) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Masayuki Fujita, Yusaku Izawa, Masaki Hashida, Yuichi Setsuhara, Yasukazu Izawa, and Chiyoe Yamanaka "Ultrafast phase transition of Si by femtosecond laser pulse irradiation", Proc. SPIE 6346, XVI International Symposium on Gas Flow, Chemical Lasers, and High-Power Lasers, 63463S (8 May 2007); https://doi.org/10.1117/12.739427
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KEYWORDS
Laser ablation

Femtosecond phenomena

Silicon

Pulsed laser operation

Crystals

Laser crystals

Laser damage threshold

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