Paper
5 August 2009 Optical analysis of thermo-optic infrared focal plane array
X. Yan, F. Feng, Y. L. Wang
Author Affiliations +
Abstract
Optical characteristic of an infrared focal plane array (FPA) based on thermo-optic effect is analyzed using film optics method. Then, an optimizing film assembly of thermo-optic infrared focal plane array (TOFPA) described as air|<HL>230.1H<LH>216L|substrate is obtained with its temperature sensitivity 6.23% K-1. Furthermore, the influence of substrate material, device package and absorption is discussed. The results show that the temperature sensitivity of the film assembly of TOFPA is modulated by 16.4%, 8.99%, -11.3 %, and -0.6% with the influence of glass substrate, silicon substrate, glass package and optical absorption of film material, respectively.
© (2009) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
X. Yan, F. Feng, and Y. L. Wang "Optical analysis of thermo-optic infrared focal plane array", Proc. SPIE 7383, International Symposium on Photoelectronic Detection and Imaging 2009: Advances in Infrared Imaging and Applications, 73834S (5 August 2009); https://doi.org/10.1117/12.834912
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KEYWORDS
Reflectivity

Infrared radiation

Thermography

Absorption

Glasses

Staring arrays

Thermal optics

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