Paper
20 May 2011 Pixel level packaging for uncooled IRFPA
G. Dumont, W. Rabaud, X. Baillin, JL. Pornin, L. Carle, V. Goudon, C. Vialle, M. Pellat, A. Arnaud
Author Affiliations +
Abstract
As packaging represents a significant part of uncooled IR detectors price, a collective packaging process would contribute to enlarge uncooled IRFPA application to very low cost camera market. Since the first proof of the pixel level packaging for uncooled IRFPA in 2008, CEA-LETI is still strongly involved in the development of an innovative packaging technology. This one aims at encapsulating each pixel under vacuum in the direct continuity of the bolometer process. Moreover, a thin film getter has been developed to be integrated in the micropackaging so as to increase the packaging lifespan. This paper presents the recent development at CEA-LETI of this pixel level packaging technology including getter integration and vacuum level measurements.
© (2011) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
G. Dumont, W. Rabaud, X. Baillin, JL. Pornin, L. Carle, V. Goudon, C. Vialle, M. Pellat, and A. Arnaud "Pixel level packaging for uncooled IRFPA", Proc. SPIE 8012, Infrared Technology and Applications XXXVII, 80121I (20 May 2011); https://doi.org/10.1117/12.883852
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CITATIONS
Cited by 11 scholarly publications and 1 patent.
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KEYWORDS
Packaging

Bolometers

Thin films

Microbolometers

Etching

Resistance

Semiconducting wafers

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