High speed micro scanner for 3D in-volume laser micro processing

D. Schaefer; J. Gottmann; M. Hermans; J. Ortmann; I. Kelbassa

doi:10.1117/12.2008205

15 March 2013 High speed micro scanner for 3D in-volume laser micro processing

D. Schaefer, J. Gottmann, M. Hermans, J. Ortmann, I. Kelbassa

Proceedings Volume 8608, Laser-based Micro- and Nanopackaging and Assembly VII; 860808 (2013) https://doi.org/10.1117/12.2008205
Event: SPIE LASE, 2013, San Francisco, California, United States

Abstract

Using an in-house developed micro scanner three-dimensional micro components and micro fluidic devices in fused silica are realized using the ISLE process (in-volume selective laser-induced etching). With the micro scanner system the potential of high average power femtosecond lasers (P > 100 W) is exploited by the fabrication of components with micrometer precision at scan speeds of several meters per second. A commercially available galvanometer scanner is combined with an acousto-optical and/or electro-optical beam deflector and translation stages. For focusing laser radiation high numerical aperture microscope objectives (NA > 0.3) are used generating a focal volume of a few cubic micrometers. After laser exposure the materials are chemically wet etched in aqueous solution. The laser-exposed material is etched whereas the unexposed material remains nearly unchanged. Using the described technique called ISLE the fabrication of three-dimensional micro components, micro holes, cuts and channels is possible with high average power femtosecond lasers resulting in a reduced processing time for exposure. By developing the high speed micro scanner up-scaling of the ISLE process is demonstrated. The fabricated components made out of glass can be applied in various markets like biological and medical diagnostics as well as in micro mechanics.

Citation Download Citation

D. Schaefer, J. Gottmann, M. Hermans, J. Ortmann, and I. Kelbassa "High speed micro scanner for 3D in-volume laser micro processing", Proc. SPIE 8608, Laser-based Micro- and Nanopackaging and Assembly VII, 860808 (15 March 2013); https://doi.org/10.1117/12.2008205

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