Paper
19 March 2015 Influence of the process-induced asymmetry on the accuracy of overlay measurements
Tetyana Shapoval, Bernd Schulz, Tal Itzkovich, Sean Durran, Ronny Haupt, Agostino Cangiano, Barak Bringoltz, Matthias Ruhm, Eric Cotte, Rolf Seltmann, Tino Hertzsch, Eitan Hajaj, Carsten Hartig, Boris Efraty, Daniel Fischer
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Abstract
In the current paper we are addressing three questions relevant for accuracy: 1. Which target design has the best performance and depicts the behavior of the actual device? 2. Which metrology signal characteristics could help to distinguish between the target asymmetry related overlay shift and the real process related shift? 3. How does uncompensated asymmetry of the reference layer target, generated during after-litho processes, affect the propagation of overlay error through different layers? We are presenting the correlation between simulation data based on the optical properties of the measured stack and KLA-Tencor’s Archer overlay measurements on a 28nm product through several critical layers for those accuracy aspects.
© (2015) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Tetyana Shapoval, Bernd Schulz, Tal Itzkovich, Sean Durran, Ronny Haupt, Agostino Cangiano, Barak Bringoltz, Matthias Ruhm, Eric Cotte, Rolf Seltmann, Tino Hertzsch, Eitan Hajaj, Carsten Hartig, Boris Efraty, and Daniel Fischer "Influence of the process-induced asymmetry on the accuracy of overlay measurements", Proc. SPIE 9424, Metrology, Inspection, and Process Control for Microlithography XXIX, 94240B (19 March 2015); https://doi.org/10.1117/12.2085788
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Cited by 2 scholarly publications and 1 patent.
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KEYWORDS
Optical filters

Overlay metrology

Data modeling

Semiconducting wafers

Metrology

Optical properties

Optical simulations

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